Engineering & Materials Science
Plating
100%
Superconducting films
72%
Sapphire
69%
Metals
53%
Deposits
49%
Current density
38%
Limiters
36%
Temperature
31%
Substrates
31%
Electric current control
31%
Gold
27%
Magnetic fields
26%
Critical currents
24%
Electrodeposition
24%
Thermal conductivity
24%
Heating
21%
Robots
19%
Temperature distribution
16%
High temperature superconductors
14%
Hot Temperature
13%
Stabilization
12%
Gold plating
12%
Cathodes
9%
Networks (circuits)
9%
Coolants
9%
Electric potential
8%
Control systems
7%
Surface morphology
6%
Controllers
6%
Velocity measurement
6%
Electroplating
6%
Computer simulation
5%
Physics & Astronomy
plating
65%
sapphire
50%
alternating current
44%
deposits
38%
current density
35%
superconducting films
34%
critical current
31%
pulses
29%
metals
27%
direct current
27%
inhomogeneity
20%
temperature
20%
heating
18%
thin films
17%
conductivity
16%
heat
16%
gold
16%
temperature distribution
16%
magnetic fields
14%
electric potential
13%
baths
13%
electrodeposition
12%
coolants
11%
high temperature superconductors
10%
pulse duration
9%
throwing
9%
hollow
8%
cathodes
7%
thermal conductivity
7%
thermodynamics
6%
root-mean-square errors
6%
electroplating
5%
simulation
5%
predictions
5%
Chemical Compounds
Superconducting Film
49%
Metal
40%
Current Density
36%
Thermal Conductivity
32%
Cylinder
31%
Electrodeposition
29%
Magnetic Field
27%
Liquid Film
19%
Voltage
17%
Length
14%
Weight
14%
Coolant
13%
Reduction
11%
Superconductor
11%
Simulation
9%
Error
7%
Heat
7%
Cathode
7%
Surface
7%
Time
5%
Current Efficiency
5%
Reaction Yield
5%