ΘJC characterization of chip packages - Justification, limitations, and future

A. Bar-Cohen, T. Elperin, R. Eliasi

Research output: Contribution to conferencePaperpeer-review

6 Scopus citations

Abstract

A discussion is presented of thermal figures-of-merit (FOMs) for chip package thermal resistance, for use in evaluating competing thermal designs, and analysis techniques, for use in determining operating temperature profiles. The junction-to-case thermal resistance, ΘJC, as well as the junction-to-fluid thermal resistance, have been used in both of these roles for first-level packaging. The use of a modified ΘJC is proposed. Experimental data indicate that the relations developed are capable not only of accurately describing the chip temperature for a variety of thermal management strategies, but also of highlighting the impact of specific thermal design features.

Original languageEnglish
Pages1-4
Number of pages4
StatePublished - 1 Dec 1989
Externally publishedYes
EventFifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (SEMI-THERM) Proceedings 1989 - San Diego, CA, USA
Duration: 7 Feb 19899 Feb 1989

Conference

ConferenceFifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (SEMI-THERM) Proceedings 1989
CitySan Diego, CA, USA
Period7/02/899/02/89

ASJC Scopus subject areas

  • Engineering (all)

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