Abstract
Recent years have witnessed a proliferation in the use of θjc for the thermal characterization of chip packages. The longevity of θjc can be traced to its simplicity, its utility as a figure of merit, and its convenient use in numerical analysis of packaging configurations. To enhance the utility of this parameter, it is proposed to recognize the distinct contribution of various segments of the “case” area to the junction temperature and to embody this dependence in a modified-θjc relation. The analytical basis and methodology to be used in obtaining this relation are presented and illustruated by use of detailed chip package temperatures obtained from numerical analysis of a generic PLCC package.
Original language | English |
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Pages (from-to) | 724-731 |
Number of pages | 8 |
Journal | IEEE Transactions on Components, Hybrids and Manufacturing Technology |
Volume | 12 |
Issue number | 4 |
DOIs | |
State | Published - 1 Jan 1989 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- General Engineering
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering