θjc Characterization of Chip Packages—Justification, Limitations, and Future

Avram Bar-Cohen, Tov Elperin, Rami Eliasi

Research output: Contribution to journalArticlepeer-review

87 Scopus citations

Abstract

Recent years have witnessed a proliferation in the use of θjc for the thermal characterization of chip packages. The longevity of θjc can be traced to its simplicity, its utility as a figure of merit, and its convenient use in numerical analysis of packaging configurations. To enhance the utility of this parameter, it is proposed to recognize the distinct contribution of various segments of the “case” area to the junction temperature and to embody this dependence in a modified-θjc relation. The analytical basis and methodology to be used in obtaining this relation are presented and illustruated by use of detailed chip package temperatures obtained from numerical analysis of a generic PLCC package.

Original languageEnglish
Pages (from-to)724-731
Number of pages8
JournalIEEE Transactions on Components, Hybrids and Manufacturing Technology
Volume12
Issue number4
DOIs
StatePublished - 1 Jan 1989

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • General Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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