TY - GEN
T1 - 0.45v and 18pA/MHz MCU SOC with advanced Adaptive Dynamic Voltage Control (ADVC)
AU - Zangi, Uzi
AU - Feldman, Neil
AU - Shor, Joseph
AU - Fish, Alexander
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/2
Y1 - 2017/7/2
N2 - An Ultra-low power MCU SOC is described with integrated DC to DC power management and Adaptive Dynamic Voltage Control (ADVC) mechanism. The SOC includes the complete Synopsys ARC EM5D core MCU, featuring a full set of DSP instructions and minimizing energy consumption at a wide range of frequencies: 312K-80MHz. On-die Silicon sensors are utilized to continuously change the operating voltage to optimize power/performance for a given frequency and environmental conditions and also to resolve yield and life time problems while operating at low voltages. The core operates between 0.45-1.1V volts with a direct battery connection for an input voltage of 1.0-3.8V. The peak energy efficiency is 18μA/MHz. A comparison to state-of-the-art commercial SOCs is presented, showing a 3-5x improved current/DMIPS (Dhrystone Million Instructions per sec) compared to the next best chip.
AB - An Ultra-low power MCU SOC is described with integrated DC to DC power management and Adaptive Dynamic Voltage Control (ADVC) mechanism. The SOC includes the complete Synopsys ARC EM5D core MCU, featuring a full set of DSP instructions and minimizing energy consumption at a wide range of frequencies: 312K-80MHz. On-die Silicon sensors are utilized to continuously change the operating voltage to optimize power/performance for a given frequency and environmental conditions and also to resolve yield and life time problems while operating at low voltages. The core operates between 0.45-1.1V volts with a direct battery connection for an input voltage of 1.0-3.8V. The peak energy efficiency is 18μA/MHz. A comparison to state-of-the-art commercial SOCs is presented, showing a 3-5x improved current/DMIPS (Dhrystone Million Instructions per sec) compared to the next best chip.
UR - http://www.scopus.com/inward/record.url?scp=85047555106&partnerID=8YFLogxK
U2 - 10.1109/S3S.2017.8308745
DO - 10.1109/S3S.2017.8308745
M3 - Conference contribution
AN - SCOPUS:85047555106
T3 - 2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017
SP - 1
EP - 2
BT - 2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017
PB - Institute of Electrical and Electronics Engineers
T2 - 2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017
Y2 - 16 October 2017 through 18 October 2017
ER -