3D Marketplace: Distributed Attestation of 3D Designs on Blockchain

Nachiket Tapas, Sofia Belikovetsky, Francesco Longo, Antonio Puliafito, Asaf Shabtai, Yuval Elovici

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Industry 4.0 encourages the integration of intelligent technology with manufacturing systems. Among them, additive manufacturing (AM) is critical to solving some of the fourth industrial revolution's most pressing needs. With AM gaining popularity, the need for the validation of 3D designs grows. In this paper, we introduce a novel concept of a distributed marketplace that will support the attestation of 3D printing designs. We build a mathematical trust model that ensures truthfulness among rational, selfish, and independent agents, which is based on a reward/penalty system. The payment for participating in the evaluation is calculated by factoring in agents' reputations and peer feedback. Moreover, we describe the architecture and the implementation of the trust model on the blockchain using smart contracts for the creation of a distributed marketplace. Our model relies both on theoretical and practical best practices to create a unique platform that elicits effort and truthfulness from the participants. Finally, we present a performance evaluation and cost analysis of the proposed architecture to evaluate scalability and financial viability.

Original languageEnglish
Title of host publicationProceedings - 2022 IEEE International Conference on Smart Computing, SMARTCOMP 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages311-316
Number of pages6
ISBN (Electronic)9781665481526
DOIs
StatePublished - 1 Jan 2022
Event8th IEEE International Conference on Smart Computing, SMARTCOMP 2022 - Espoo, Finland
Duration: 20 Jun 202224 Jun 2022

Publication series

NameProceedings - 2022 IEEE International Conference on Smart Computing, SMARTCOMP 2022

Conference

Conference8th IEEE International Conference on Smart Computing, SMARTCOMP 2022
Country/TerritoryFinland
CityEspoo
Period20/06/2224/06/22

Keywords

  • 3D Printing
  • Additive Manufacturing
  • Blockchain
  • Distributed Market
  • IIoT
  • Industry 4.0
  • Truthfulness

ASJC Scopus subject areas

  • Artificial Intelligence
  • Computer Science Applications
  • Computer Vision and Pattern Recognition

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