@inproceedings{db4a84b8333a4152b4a9f71d012fd4c9,
title = "3D Marketplace: Distributed Attestation of 3D Designs on Blockchain",
abstract = "Industry 4.0 encourages the integration of intelligent technology with manufacturing systems. Among them, additive manufacturing (AM) is critical to solving some of the fourth industrial revolution's most pressing needs. With AM gaining popularity, the need for the validation of 3D designs grows. In this paper, we introduce a novel concept of a distributed marketplace that will support the attestation of 3D printing designs. We build a mathematical trust model that ensures truthfulness among rational, selfish, and independent agents, which is based on a reward/penalty system. The payment for participating in the evaluation is calculated by factoring in agents' reputations and peer feedback. Moreover, we describe the architecture and the implementation of the trust model on the blockchain using smart contracts for the creation of a distributed marketplace. Our model relies both on theoretical and practical best practices to create a unique platform that elicits effort and truthfulness from the participants. Finally, we present a performance evaluation and cost analysis of the proposed architecture to evaluate scalability and financial viability.",
keywords = "3D Printing, Additive Manufacturing, Blockchain, Distributed Market, IIoT, Industry 4.0, Truthfulness",
author = "Nachiket Tapas and Sofia Belikovetsky and Francesco Longo and Antonio Puliafito and Asaf Shabtai and Yuval Elovici",
note = "Funding Information: ACKNOWLEDGMENT This research received funding from the Italian Ministry for University and Research under the FISR 2020 Covid program within the project ”A distributed factory for intelligent, decentralized, sustainable and resilient production (Air Factories 2.0)”. Publisher Copyright: {\textcopyright} 2022 IEEE.; 8th IEEE International Conference on Smart Computing, SMARTCOMP 2022 ; Conference date: 20-06-2022 Through 24-06-2022",
year = "2022",
month = jan,
day = "1",
doi = "10.1109/SMARTCOMP55677.2022.00073",
language = "English",
series = "Proceedings - 2022 IEEE International Conference on Smart Computing, SMARTCOMP 2022",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "311--316",
booktitle = "Proceedings - 2022 IEEE International Conference on Smart Computing, SMARTCOMP 2022",
address = "United States",
}