TY - GEN
T1 - A Comprehensive Evaluation of Power Delivery Schemes for Modern Microprocessors
AU - Haj-Yahya, Jawad
AU - Rotem, Efraim
AU - Mendelson, Avi
AU - Chattopadhyay, Anupam
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/4/23
Y1 - 2019/4/23
N2 - The continuous quest for energy-efficient computing has led towards the adoption of fine-grained controls in processor sub-systems, of which power delivery network is the most prominent one. Recent industry trends reflect a shift towards on-chip, integrated voltage regulator (IVRs) to that effect. We undertake a thorough and quantitative evaluation of different power delivery networks for modern microprocessors. In contrast to the current trend, we conclude that IVR schemes perform worse compared to the conventional off-chip voltage regulator scheme. Further, we present studies on diverse workloads and Thermal Design Points (TDPs) to highlight the importance of workload-specific power delivery scheme. To the best of our knowledge, this is the first comprehensive study across processors' TDPs and workloads.
AB - The continuous quest for energy-efficient computing has led towards the adoption of fine-grained controls in processor sub-systems, of which power delivery network is the most prominent one. Recent industry trends reflect a shift towards on-chip, integrated voltage regulator (IVRs) to that effect. We undertake a thorough and quantitative evaluation of different power delivery networks for modern microprocessors. In contrast to the current trend, we conclude that IVR schemes perform worse compared to the conventional off-chip voltage regulator scheme. Further, we present studies on diverse workloads and Thermal Design Points (TDPs) to highlight the importance of workload-specific power delivery scheme. To the best of our knowledge, this is the first comprehensive study across processors' TDPs and workloads.
KW - Energy-Efficiency
KW - FIVR
KW - Integrated Voltage Regulator
KW - MBVR
KW - Power Delivery
UR - http://www.scopus.com/inward/record.url?scp=85065188949&partnerID=8YFLogxK
U2 - 10.1109/ISQED.2019.8697544
DO - 10.1109/ISQED.2019.8697544
M3 - Conference contribution
AN - SCOPUS:85065188949
T3 - Proceedings - International Symposium on Quality Electronic Design, ISQED
SP - 123
EP - 130
BT - Proceedings of the 20th International Symposium on Quality Electronic Design, ISQED 2019
PB - Institute of Electrical and Electronics Engineers
T2 - 20th International Symposium on Quality Electronic Design, ISQED 2019
Y2 - 6 March 2019 through 7 March 2019
ER -
