The method of overpotential stabilization to control metal deposition during the pulse plating process is discussed. The method of overpotential stabilization depends on the ratio between the rate of overpotential change during the plating pulse and the width of the plating pulse. The method was applied to pulse plating of gold in a barrier bath under a given set of fixed conditions. a control system for the metal electrodeposition based on the method was designed and tested on gold plating chip carriers. The results of the experiments showed that the deposits made using the overpotantial method have a smoother surface.
ASJC Scopus subject areas
- Waste Management and Disposal
- Polymers and Plastics
- Metals and Alloys
- Industrial and Manufacturing Engineering