A new approach to controlling metal deposition during the pulse plating process

M. Gladstein; H. Guterman

doi:10.1016/S0026-0576(02)80688-2

A new approach to controlling metal deposition during the pulse plating process

M. Gladstein, H. Guterman

Department of Electrical & Computer Engineering

Research output: Contribution to journal › Comment/debate

6 Scopus citations

Abstract

The method of overpotential stabilization to control metal deposition during the pulse plating process is discussed. The method of overpotential stabilization depends on the ratio between the rate of overpotential change during the plating pulse and the width of the plating pulse. The method was applied to pulse plating of gold in a barrier bath under a given set of fixed conditions. a control system for the metal electrodeposition based on the method was designed and tested on gold plating chip carriers. The results of the experiments showed that the deposits made using the overpotantial method have a smoother surface.

Original language	English
Pages (from-to)	26-33
Number of pages	8
Journal	Metal Finishing
Volume	100
Issue number	8
DOIs	https://doi.org/10.1016/S0026-0576(02)80688-2
State	Published - 1 Jan 2002

ASJC Scopus subject areas

Waste Management and Disposal
Pollution
Polymers and Plastics
Metals and Alloys
Industrial and Manufacturing Engineering

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10.1016/S0026-0576(02)80688-2

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abstract = "The method of overpotential stabilization to control metal deposition during the pulse plating process is discussed. The method of overpotential stabilization depends on the ratio between the rate of overpotential change during the plating pulse and the width of the plating pulse. The method was applied to pulse plating of gold in a barrier bath under a given set of fixed conditions. a control system for the metal electrodeposition based on the method was designed and tested on gold plating chip carriers. The results of the experiments showed that the deposits made using the overpotantial method have a smoother surface.",

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AB - The method of overpotential stabilization to control metal deposition during the pulse plating process is discussed. The method of overpotential stabilization depends on the ratio between the rate of overpotential change during the plating pulse and the width of the plating pulse. The method was applied to pulse plating of gold in a barrier bath under a given set of fixed conditions. a control system for the metal electrodeposition based on the method was designed and tested on gold plating chip carriers. The results of the experiments showed that the deposits made using the overpotantial method have a smoother surface.

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A new approach to controlling metal deposition during the pulse plating process

Abstract

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