A New Electrolytic Solution for the Direct Electrodeposition of Copper on Aluminum and Other Chemically Reactive Substrates

A. Bettelheim, A. Raveh, U. Mor, R. Ydgar, B. Segal

Research output: Contribution to journalArticlepeer-review

9 Scopus citations
Original languageEnglish
Pages (from-to)3151-3153
Number of pages3
JournalJournal of the Electrochemical Society
Volume137
Issue number10
DOIs
StatePublished - 1 Jan 1990
Externally publishedYes

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