A TEM structural study of thermal stability of magnetic tunnel junctions integrated with CMOS devices

V. K. Lazarov, A. Kohn, T. Uhrmann, T. Dimopoulos, H. Brückl, H. Achard, C. Baraduc, S. Vizzini, H. Oughaddou, B. Aufray, A. D'Avitaya

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Material Science