Artificial Intelligence Measurement in Imaging-Based Overlay Metrology for Performance Boost

Sveta Grechin, Shlomit Katz, Kei Maeda, Tsumugi Hirasawa, Hisashi Otsubo, Seigo Aoki, Atsushi Takahashi, Atsushi Miyafuji, Ofer Manos, Yu Yang, Tal Levinson, Ran Trifon, Dor Yehuda, Hamode Hegaze, Yuval Lamhot, Yair Vardi, Yoav Grauer, Avner Safrani, Cindy Kato, Iwata YasuhisaImura Koichi, Ito Kosuke, Hayashi Masanobu, Eunjoong An, Nana Lan, Simon Ahn

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Advanced semiconductor devices target sub-2nm on-product overlay (OPO) and manufacturers utilize dense overlay (OVL) sampling and non-zero offset (NZO) control to enable such strict performance. Accurate optical OVL metrology systems with fast move-and-measurement (MAM) utilized at the after-develop inspection (ADI) step are required to support this OPO trend. This work presents an innovative Artificial Intelligence (AI) based, ultra-high-speed, overlay target focusing and centering approach on imaging-based overlay (IBO) measurements in the ADI step. The algorithm uses pre-trained image features and a deep learning model. The algorithm allows the measurement of every site across the wafer in its best centering and contrast focus position and thus overcomes intra-wafer process variations and enhanced measurement accuracy. The data will include results from multi-lot advanced DRAM process with basic performance analysis such as total measurement uncertainty (TMU), tool-to-tool matching (TTTM) and additional key performance indicators (KPIs).

Original languageEnglish
Title of host publicationMetrology, Inspection, and Process Control XXXVIII
EditorsMatthew J. Sendelbach, Nivea G. Schuch
PublisherSPIE
ISBN (Electronic)9781510672161
DOIs
StatePublished - 1 Jan 2024
Externally publishedYes
EventMetrology, Inspection, and Process Control XXXVIII 2024 - San Jose, United States
Duration: 26 Feb 202429 Feb 2024

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume12955
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceMetrology, Inspection, and Process Control XXXVIII 2024
Country/TerritoryUnited States
CitySan Jose
Period26/02/2429/02/24

Keywords

  • Artificial Intelligence (AI)
  • Data Analytics
  • Imaging-Based Overlay (IBO)
  • Machine Learning (ML)
  • On-Product Overlay (OPO)
  • Overlay (OVL)
  • Photolithography
  • Total Measurement Uncertainty (TMU)

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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