Atom chips: Fabrication and thermal properties

S. Groth, P. Krüger, S. Wildermuth, R. Folman, T. Fernholz, J. Schmiedmayer, D. Mahalu, I. Bar-Joseph

Research output: Contribution to journalArticlepeer-review

83 Scopus citations


A method for fabricating atom chips with a lithographic lift-off process was discussed. Wires that can tolerate high current densities of >10 7 A/cm2 were produced with this method. It was found that the fabrication process leads to very accurate edge and bulk features, limited by the grain size of 50-80 nm. Among the materials tested, silicon was found to be the best suited substrate for atom chips.

Original languageEnglish
Pages (from-to)2980-2982
Number of pages3
JournalApplied Physics Letters
Issue number14
StatePublished - 4 Oct 2004
Externally publishedYes

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)


Dive into the research topics of 'Atom chips: Fabrication and thermal properties'. Together they form a unique fingerprint.

Cite this