Abstract
Formation of Cu-C composite is a difficult technological problem: carbon is practically insoluble in copper. We show that the heat treatment of the Cu-C composite leads to the formation of thin (approximately 50 nm) interface, which provides the bonding between fiber and matrix. The high-resolution scanning electron microscopy (HR SEM) study displays the formation of the interaction zone. Monte Carlo simulations with repulsive Cu-C interatomic potentials study this zone on the interface.
Original language | English |
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Pages (from-to) | 191-193 |
Number of pages | 3 |
Journal | Materials Science and Engineering C |
Volume | 15 |
Issue number | 1-2 |
DOIs | |
State | Published - 19 Sep 2001 |
Keywords
- C
- Composite
- Cu
- Interatomic potentials
- Solid solutions
ASJC Scopus subject areas
- Materials Science (all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering