Abstract
The heights of diffusion barriers for copper-based composite materials with carbon whiskers or fibers are calculated. It is shown that the alloying of the matrix by an additional element, substituting copper in an interstitial Cu-C solid solution changes the value of the barrier and the migration entropy. These substitutional impurities significantly influence the diffusivity of carbon in the copper matrix. Zirconium is predicted as the best alloying element for preventing the diffusion of carbon in Cu-C alloy.
| Original language | English |
|---|---|
| Pages (from-to) | 13-16 |
| Number of pages | 4 |
| Journal | Sensors and Actuators A: Physical |
| Volume | 51 |
| Issue number | 1 |
| DOIs | |
| State | Published - 1 Jan 1995 |
Keywords
- Copper
- Diffusion
- Metal matrix composite
- Zirconium
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Instrumentation
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Metals and Alloys
- Electrical and Electronic Engineering
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