TY - GEN
T1 - Challenges in CMOS imager design
AU - Yadid-Pecht, O.
PY - 2004/12/1
Y1 - 2004/12/1
N2 - In the last decade, Active Pixel Sensors (APS), which are fabricated in a commonly used CMOS process, enabled the design of image sensors with integrated "intelligence." Current state of the art CMOS imagers allow integration of all functions required for timing, exposure control, color processing, image enhancement, image compression and ADC on the same die. Moreover, systems with wide dynamic range, motion detection and non-standard readout can be designed. CMOS imagers also offer significant advantages in terms of low-power, low-voltage and monolithic integration, rivaling traditional Charge Coupled Devices (CCD). This talk will cover state of the art CMOS imager systems and design challenges with the advanced CMOS technologies available. Specifically, ways to improve power consumption in such "smart" sensors, required to cope with the current demand for portable systems are reviewed. In addition, pixel optimization is revisited as more advanced processes are used and pixel pitch is reduced.
AB - In the last decade, Active Pixel Sensors (APS), which are fabricated in a commonly used CMOS process, enabled the design of image sensors with integrated "intelligence." Current state of the art CMOS imagers allow integration of all functions required for timing, exposure control, color processing, image enhancement, image compression and ADC on the same die. Moreover, systems with wide dynamic range, motion detection and non-standard readout can be designed. CMOS imagers also offer significant advantages in terms of low-power, low-voltage and monolithic integration, rivaling traditional Charge Coupled Devices (CCD). This talk will cover state of the art CMOS imager systems and design challenges with the advanced CMOS technologies available. Specifically, ways to improve power consumption in such "smart" sensors, required to cope with the current demand for portable systems are reviewed. In addition, pixel optimization is revisited as more advanced processes are used and pixel pitch is reduced.
UR - http://www.scopus.com/inward/record.url?scp=27644446049&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:27644446049
SN - 0780387155
T3 - 11th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2004
SP - 240
BT - 11th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2004
T2 - 11th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2004
Y2 - 13 December 2004 through 15 December 2004
ER -