Abstract
Titanium coatings obtained by the RF cold plasma technique at a temperature of 550°C were characterized in order to create a model mechanism for the formation process. Scanning Electron Microscopy (SEM), X-ray diffraction, Transmission Electron Microscopy (TEM), Energy Dispersive Analysis of X-ray (EDAX) and Auger Electron Spectroscopy (AES) were employed to identify and to characterize the sputtered films. The coatings obtained were composed of titanium-copper intermetallic compounds. It is suggested that the intermetallic compounds are formed in a solid state reaction due to local energetic processes taking place in the plasma, in spite of the relatively low temperature of the substrate. According to the suggested model copper migrates outwards from the substrate, in an enhanced synergistic process, along the surfaces of the titanium deposited particles.
Original language | English |
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Pages (from-to) | 231-233 |
Number of pages | 3 |
Journal | Vacuum |
Volume | 33 |
Issue number | 4 |
DOIs | |
State | Published - 1 Jan 1983 |
ASJC Scopus subject areas
- Instrumentation
- Condensed Matter Physics
- Surfaces, Coatings and Films