Conducting a metrology measurement using M-FOUP system in fab environment

Yevgeny Lifshitz; Jeffrey Wood; David Novack; Jack Downey; Binay Dash; Shiladitya Chakravorty; Michael Raga-Baron; Taher Kagalwala; Alfred Hajtman; John Byrnes; Csaba Nándor Bitvai; Anna Bölcskei-Molná; Peter Basa

doi:10.1117/12.2614337

Conducting a metrology measurement using M-FOUP system in fab environment

Yevgeny Lifshitz, Jeffrey Wood, David Novack, Jack Downey, Binay Dash, Shiladitya Chakravorty, Michael Raga-Baron, Taher Kagalwala, Alfred Hajtman, John Byrnes, Csaba Nándor Bitvai, Anna Bölcskei-Molná, Peter Basa

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

The metrology FOUP (M-FOUP) is a self-contained metrology tool in a wafer carrier. This metrology concept, which was designed and manufactured by SEMILAB, is actively being evaluated in GLOBALFOUNDRIES. The M-FOUP system consists of a controller (MCONTROLLER), which controls multiple M-FOUP measurement units. Each independently operated M-FOUP unit utilizes a multi-point spectroscopic reflectometry technique, which can be used for many thickness applications. The self-contained metrology device has advantages over traditional film thickness measurement tools including reduced cost, significantly smaller footprint, and increased availability. In a previous article we focused on the technical details of the M-FOUP unit such as the overall design, the temperature distribution, charging/discharging routine, typical spectra, and typical wafer map. The focus of this work is on integrating the M-FOUP system into a semiconductor fab environment. This requires a high-level orchestration of multiple fab systems including the automated material handling system (AMHS), real-time dispatching (RTD) system and the MFOUP system itself. The management of the metrology jobs and data collection using M-FOUP from a point of view of Manufacturing Execution System (MES) are discussed.

Original language	English
Title of host publication	Metrology, Inspection, and Process Control XXXVI
Editors	John C. Robinson, Matthew J. Sendelbach
Publisher	SPIE
ISBN (Electronic)	9781510649811
DOIs	https://doi.org/10.1117/12.2614337
State	Published - 1 Jan 2022
Externally published	Yes
Event	Metrology, Inspection, and Process Control XXXVI 2022 - Virtual, Online Duration: 23 May 2022 → 27 May 2022

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Volume	12053
ISSN (Print)	0277-786X
ISSN (Electronic)	1996-756X

Conference

Conference	Metrology, Inspection, and Process Control XXXVI 2022
City	Virtual, Online
Period	23/05/22 → 27/05/22

Keywords

Design Enablement
Device Development
Fab Automation
M-FOUP
M-FOUP system
Metrology

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

Access to Document

10.1117/12.2614337

Cite this

Lifshitz, Y., Wood, J., Novack, D., Downey, J., Dash, B., Chakravorty, S., Raga-Baron, M., Kagalwala, T., Hajtman, A., Byrnes, J., Bitvai, C. N., Bölcskei-Molná, A., & Basa, P. (2022). Conducting a metrology measurement using M-FOUP system in fab environment. In J. C. Robinson, & M. J. Sendelbach (Eds.), Metrology, Inspection, and Process Control XXXVI Article 1205328 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 12053). SPIE. https://doi.org/10.1117/12.2614337

@inproceedings{45ff09ee16ae4abcb5de7beec31d4267,

title = "Conducting a metrology measurement using M-FOUP system in fab environment",

abstract = "The metrology FOUP (M-FOUP) is a self-contained metrology tool in a wafer carrier. This metrology concept, which was designed and manufactured by SEMILAB, is actively being evaluated in GLOBALFOUNDRIES. The M-FOUP system consists of a controller (MCONTROLLER), which controls multiple M-FOUP measurement units. Each independently operated M-FOUP unit utilizes a multi-point spectroscopic reflectometry technique, which can be used for many thickness applications. The self-contained metrology device has advantages over traditional film thickness measurement tools including reduced cost, significantly smaller footprint, and increased availability. In a previous article we focused on the technical details of the M-FOUP unit such as the overall design, the temperature distribution, charging/discharging routine, typical spectra, and typical wafer map. The focus of this work is on integrating the M-FOUP system into a semiconductor fab environment. This requires a high-level orchestration of multiple fab systems including the automated material handling system (AMHS), real-time dispatching (RTD) system and the MFOUP system itself. The management of the metrology jobs and data collection using M-FOUP from a point of view of Manufacturing Execution System (MES) are discussed.",

keywords = "Design Enablement, Device Development, Fab Automation, M-FOUP, M-FOUP system, Metrology",

author = "Yevgeny Lifshitz and Jeffrey Wood and David Novack and Jack Downey and Binay Dash and Shiladitya Chakravorty and Michael Raga-Baron and Taher Kagalwala and Alfred Hajtman and John Byrnes and Bitvai, {Csaba N{\'a}ndor} and Anna B{\"o}lcskei-Moln{\'a} and Peter Basa",

year = "2022",

month = jan,

day = "1",

doi = "10.1117/12.2614337",

language = "English",

series = "Proceedings of SPIE - The International Society for Optical Engineering",

publisher = "SPIE",

editor = "Robinson, {John C.} and Sendelbach, {Matthew J.}",

booktitle = "Metrology, Inspection, and Process Control XXXVI",

address = "United States",

}

Lifshitz, Y, Wood, J, Novack, D, Downey, J, Dash, B, Chakravorty, S, Raga-Baron, M, Kagalwala, T, Hajtman, A, Byrnes, J, Bitvai, CN, Bölcskei-Molná, A & Basa, P 2022, Conducting a metrology measurement using M-FOUP system in fab environment. in JC Robinson & MJ Sendelbach (eds), Metrology, Inspection, and Process Control XXXVI., 1205328, Proceedings of SPIE - The International Society for Optical Engineering, vol. 12053, SPIE, Metrology, Inspection, and Process Control XXXVI 2022, Virtual, Online, 23/05/22. https://doi.org/10.1117/12.2614337

Conducting a metrology measurement using M-FOUP system in fab environment. / Lifshitz, Yevgeny; Wood, Jeffrey; Novack, David et al.
Metrology, Inspection, and Process Control XXXVI. ed. / John C. Robinson; Matthew J. Sendelbach. SPIE, 2022. 1205328 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 12053).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Conducting a metrology measurement using M-FOUP system in fab environment

AU - Lifshitz, Yevgeny

AU - Wood, Jeffrey

AU - Novack, David

AU - Downey, Jack

AU - Dash, Binay

AU - Chakravorty, Shiladitya

AU - Raga-Baron, Michael

AU - Kagalwala, Taher

AU - Hajtman, Alfred

AU - Byrnes, John

AU - Bitvai, Csaba Nándor

AU - Bölcskei-Molná, Anna

AU - Basa, Peter

PY - 2022/1/1

Y1 - 2022/1/1

N2 - The metrology FOUP (M-FOUP) is a self-contained metrology tool in a wafer carrier. This metrology concept, which was designed and manufactured by SEMILAB, is actively being evaluated in GLOBALFOUNDRIES. The M-FOUP system consists of a controller (MCONTROLLER), which controls multiple M-FOUP measurement units. Each independently operated M-FOUP unit utilizes a multi-point spectroscopic reflectometry technique, which can be used for many thickness applications. The self-contained metrology device has advantages over traditional film thickness measurement tools including reduced cost, significantly smaller footprint, and increased availability. In a previous article we focused on the technical details of the M-FOUP unit such as the overall design, the temperature distribution, charging/discharging routine, typical spectra, and typical wafer map. The focus of this work is on integrating the M-FOUP system into a semiconductor fab environment. This requires a high-level orchestration of multiple fab systems including the automated material handling system (AMHS), real-time dispatching (RTD) system and the MFOUP system itself. The management of the metrology jobs and data collection using M-FOUP from a point of view of Manufacturing Execution System (MES) are discussed.

AB - The metrology FOUP (M-FOUP) is a self-contained metrology tool in a wafer carrier. This metrology concept, which was designed and manufactured by SEMILAB, is actively being evaluated in GLOBALFOUNDRIES. The M-FOUP system consists of a controller (MCONTROLLER), which controls multiple M-FOUP measurement units. Each independently operated M-FOUP unit utilizes a multi-point spectroscopic reflectometry technique, which can be used for many thickness applications. The self-contained metrology device has advantages over traditional film thickness measurement tools including reduced cost, significantly smaller footprint, and increased availability. In a previous article we focused on the technical details of the M-FOUP unit such as the overall design, the temperature distribution, charging/discharging routine, typical spectra, and typical wafer map. The focus of this work is on integrating the M-FOUP system into a semiconductor fab environment. This requires a high-level orchestration of multiple fab systems including the automated material handling system (AMHS), real-time dispatching (RTD) system and the MFOUP system itself. The management of the metrology jobs and data collection using M-FOUP from a point of view of Manufacturing Execution System (MES) are discussed.

KW - Design Enablement

KW - Device Development

KW - Fab Automation

KW - M-FOUP

KW - M-FOUP system

KW - Metrology

UR - http://www.scopus.com/inward/record.url?scp=85135822373&partnerID=8YFLogxK

U2 - 10.1117/12.2614337

DO - 10.1117/12.2614337

M3 - Conference contribution

AN - SCOPUS:85135822373

T3 - Proceedings of SPIE - The International Society for Optical Engineering

BT - Metrology, Inspection, and Process Control XXXVI

A2 - Robinson, John C.

A2 - Sendelbach, Matthew J.

PB - SPIE

T2 - Metrology, Inspection, and Process Control XXXVI 2022

Y2 - 23 May 2022 through 27 May 2022

ER -

Conducting a metrology measurement using M-FOUP system in fab environment

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this