Controlled fracture of nonmetallic thin wafers using a laser thermal shock method

T. Elperin, G. Rudin

Research output: Contribution to journalArticlepeer-review

4 Scopus citations


We developed a theoretical model of a novel thermal laser shock method for separation of glass and glass-ceramic wafers into chips. The suggested model allowed us to determine the operating parameters of the device for wafer splitting. The investigated method involves two stages: 1) formation of a surface (blind) microcrack (or a grid of surface microcracks) using a double thermal shock method, and 2) splitting the cracked wafer into chips along the microcrack contour by applying small bending stresses. The emphasis was given to splitting of thin wafers with the thickness less than 1 mm. The latter process is more involved because of the undesirable spontaneous transition of a surface microcrack into a through crack.

Original languageEnglish
Pages (from-to)142-147
Number of pages6
JournalJournal of Electronic Packaging, Transactions of the ASME
Issue number1
StatePublished - 1 Mar 2004

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering


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