Abstract
Auger electron spectroscopy, energy electron loss spectroscopy, atomic force microscopy and transmission electron microscopy were used to characterize ultra-thin aluminum oxide films grown on hydrogen-terminated Si(0 0 1)-H substrates via a specific atomic layer deposition and oxidation technique. Oxide thin films grown in such a way are highly stable with temperature at least up to 700 °C. Band gap was estimated to be 6.6±0.2 eV, independent of thickness. Formation of the oxide layer slightly increases the initial roughness of silicon surface. Furthermore, no silicon oxide was found at the aluminum oxide-silicon interface.
Original language | English |
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Pages (from-to) | 26-29 |
Number of pages | 4 |
Journal | Journal of Crystal Growth |
Volume | 305 |
Issue number | 1 |
DOIs | |
State | Published - 1 Jul 2007 |
Externally published | Yes |
Keywords
- A1. AES
- A1. AFM
- A1. EELS
- A1. HR-TEM
- A1. Interfaces
- A1. TEM
- A2. Atomic layer deposition oxidation
- A3. Molecular beam epitaxy
- B1. Aluminum
- B1. Oxides
- B1. Silicon
- B3. Heterojunctions semiconductor devices
ASJC Scopus subject areas
- Condensed Matter Physics
- Inorganic Chemistry
- Materials Chemistry