Deposition and characterization of amorphous electroless Ni-Co-P alloy thin film for ULSI application

Anuj Kumar, Ashok Kumar Suhag, Amanpal Singh, Satinder K. Sharma, Mukesh Kumar, Dinesh Kumar

Research output: Contribution to journalArticlepeer-review

4 Scopus citations


Electroless based Ni-Co-P alloy thin films were deposited using sodium hypophosphite as a reducing agent and sodium citrate as a complexing agent in an alkaline plating bath. The effect of solution pH and temperature on the plating rate was examined. The decrease in activation energy (81.35 - 73.54 kJ mole-1) for the Ni-Co-P thin films deposited on corning glass was observed with the increase in pH (8.5-9.38) of the plating bath. There is a significant decrease in sheet resistance of alloy thin films as the post deposition annealing temperature approaches 400 °C. The presence of nickel as well as nickel phosphide peaks and transition from metastable Ni12P5, Ni8 P5 and Ni5P2 phases into thermodynamically stable NiP, NiP2, Ni3 P phases after annealing at 600 °C was observed in XRD spectra, indicating the crystallization of the thin films. Surface topography analysis shows the variation of grain size in the range 20-40 nm.

Original languageEnglish
Article number035007
JournalMaterials Research Express
Issue number3
StatePublished - 1 Sep 2014
Externally publishedYes


  • Activation energy
  • Deposition rate
  • Electroless plating Ni-Co-P alloy
  • Phase transformation
  • Thin film deposition

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Biomaterials
  • Surfaces, Coatings and Films
  • Polymers and Plastics
  • Metals and Alloys


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