Effect of sodium dodecylsulfate on the corrosion behavior of copper in borate aqueous solutions

J. Hayon, A. Bettelheim, C. Yarnitzky, J. Yahalom

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

The behavior of copper in borate buffer solution (pH 7) in the presence of the surfactant dodecylsulfate was studied using cyclic polarization, the electrochemical quartz crystal microbalance technique, and scanning electron microscopy. The results indicate absorption of dodecylsulfate causing severe pitting of the copper surface. The pitting potential (Ep) in the presence of 1000 ppm (3.5×10-3 M) surfactant is 0.04 V (vs. a standard calomel electrode) and it varies with the dodecylsulfate ion (DS-) concentration: Ep (V) = -0.123 log[DS-]-0.268. It is postulated that the formation of the complex Cu(DS)2 is involved in the pitting mechanism.

Original languageEnglish
Pages (from-to)183-185
Number of pages3
JournalElectrochemical and Solid-State Letters
Volume3
Issue number4
DOIs
StatePublished - 1 Apr 2000

ASJC Scopus subject areas

  • General Chemical Engineering
  • General Materials Science
  • Physical and Theoretical Chemistry
  • Electrochemistry
  • Electrical and Electronic Engineering

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