Effect of sodium dodecylsulfate on the corrosion behavior of copper in borate aqueous solutions

J. Hayon; A. Bettelheim; C. Yarnitzky; J. Yahalom

doi:10.1149/1.1390996

Effect of sodium dodecylsulfate on the corrosion behavior of copper in borate aqueous solutions

J. Hayon, A. Bettelheim, C. Yarnitzky, J. Yahalom

Department of Chemical Engineering

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Abstract

The behavior of copper in borate buffer solution (pH 7) in the presence of the surfactant dodecylsulfate was studied using cyclic polarization, the electrochemical quartz crystal microbalance technique, and scanning electron microscopy. The results indicate absorption of dodecylsulfate causing severe pitting of the copper surface. The pitting potential (E_p) in the presence of 1000 ppm (3.5×10^-3 M) surfactant is 0.04 V (vs. a standard calomel electrode) and it varies with the dodecylsulfate ion (DS^-) concentration: E_p (V) = -0.123 log[DS^-]-0.268. It is postulated that the formation of the complex Cu(DS)₂ is involved in the pitting mechanism.

Original language	English
Pages (from-to)	183-185
Number of pages	3
Journal	Electrochemical and Solid-State Letters
Volume	3
Issue number	4
DOIs	https://doi.org/10.1149/1.1390996
State	Published - 1 Apr 2000

ASJC Scopus subject areas

Chemical Engineering (all)
Materials Science (all)
Physical and Theoretical Chemistry
Electrochemistry
Electrical and Electronic Engineering

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@article{5da82ef751b24af49c7cf674a6150848,

title = "Effect of sodium dodecylsulfate on the corrosion behavior of copper in borate aqueous solutions",

abstract = "The behavior of copper in borate buffer solution (pH 7) in the presence of the surfactant dodecylsulfate was studied using cyclic polarization, the electrochemical quartz crystal microbalance technique, and scanning electron microscopy. The results indicate absorption of dodecylsulfate causing severe pitting of the copper surface. The pitting potential (Ep) in the presence of 1000 ppm (3.5×10-3 M) surfactant is 0.04 V (vs. a standard calomel electrode) and it varies with the dodecylsulfate ion (DS-) concentration: Ep (V) = -0.123 log[DS-]-0.268. It is postulated that the formation of the complex Cu(DS)2 is involved in the pitting mechanism.",

author = "J. Hayon and A. Bettelheim and C. Yarnitzky and J. Yahalom",

year = "2000",

month = apr,

day = "1",

doi = "10.1149/1.1390996",

language = "English",

volume = "3",

pages = "183--185",

journal = "Electrochemical and Solid-State Letters",

issn = "1099-0062",

publisher = "Electrochemical Society, Inc.",

number = "4",

}

TY - JOUR

T1 - Effect of sodium dodecylsulfate on the corrosion behavior of copper in borate aqueous solutions

AU - Hayon, J.

AU - Bettelheim, A.

AU - Yarnitzky, C.

AU - Yahalom, J.

PY - 2000/4/1

Y1 - 2000/4/1

N2 - The behavior of copper in borate buffer solution (pH 7) in the presence of the surfactant dodecylsulfate was studied using cyclic polarization, the electrochemical quartz crystal microbalance technique, and scanning electron microscopy. The results indicate absorption of dodecylsulfate causing severe pitting of the copper surface. The pitting potential (Ep) in the presence of 1000 ppm (3.5×10-3 M) surfactant is 0.04 V (vs. a standard calomel electrode) and it varies with the dodecylsulfate ion (DS-) concentration: Ep (V) = -0.123 log[DS-]-0.268. It is postulated that the formation of the complex Cu(DS)2 is involved in the pitting mechanism.

AB - The behavior of copper in borate buffer solution (pH 7) in the presence of the surfactant dodecylsulfate was studied using cyclic polarization, the electrochemical quartz crystal microbalance technique, and scanning electron microscopy. The results indicate absorption of dodecylsulfate causing severe pitting of the copper surface. The pitting potential (Ep) in the presence of 1000 ppm (3.5×10-3 M) surfactant is 0.04 V (vs. a standard calomel electrode) and it varies with the dodecylsulfate ion (DS-) concentration: Ep (V) = -0.123 log[DS-]-0.268. It is postulated that the formation of the complex Cu(DS)2 is involved in the pitting mechanism.

UR - http://www.scopus.com/inward/record.url?scp=0033890505&partnerID=8YFLogxK

U2 - 10.1149/1.1390996

DO - 10.1149/1.1390996

M3 - Article

AN - SCOPUS:0033890505

SN - 1099-0062

VL - 3

SP - 183

EP - 185

JO - Electrochemical and Solid-State Letters

JF - Electrochemical and Solid-State Letters

IS - 4

ER -

Effect of sodium dodecylsulfate on the corrosion behavior of copper in borate aqueous solutions

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