Evolution of dislocation patterns in fcc metals

P. Landau; R. Z. Shneck; G. Makov; A. Venkert

doi:10.1088/1757-899X/3/1/012004

Evolution of dislocation patterns in fcc metals

P. Landau, R. Z. Shneck, G. Makov, A. Venkert

Department of Materials Engineering

Research output: Contribution to journal › Conference article › peer-review

26 Scopus citations

Abstract

The effect of strain on the microstructure and detailed internal structure of dislocation boundaries in pure polycrystalline fcc metals (aluminum, copper, nickel and gold) was systematically studied and compared as a function of strain following compression at room temperature. At low strains all metals form a cellular structure. The dislocations in the cell walls tend to rearrange themselves from tangles to ordered arrays of parallel dislocations as the strain is increased. However the rearrangement does not correlate well with the stacking fault energy. A good correlation is found with the cross-slip activation energy.

Original language	English
Article number	012004
Journal	IOP Conference Series: Materials Science and Engineering
Volume	3
DOIs	https://doi.org/10.1088/1757-899X/3/1/012004
State	Published - 1 Dec 2009
Event	3rd International Conference on the Fundamentals of Plastic Deformation, DISLOCATIONS 2008 - Hong Kong, Hong Kong Duration: 13 Oct 2008 → 17 Oct 2008

ASJC Scopus subject areas

General Materials Science
General Engineering

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10.1088/1757-899X/3/1/012004

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title = "Evolution of dislocation patterns in fcc metals",

abstract = "The effect of strain on the microstructure and detailed internal structure of dislocation boundaries in pure polycrystalline fcc metals (aluminum, copper, nickel and gold) was systematically studied and compared as a function of strain following compression at room temperature. At low strains all metals form a cellular structure. The dislocations in the cell walls tend to rearrange themselves from tangles to ordered arrays of parallel dislocations as the strain is increased. However the rearrangement does not correlate well with the stacking fault energy. A good correlation is found with the cross-slip activation energy.",

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AU - Landau, P.

AU - Shneck, R. Z.

AU - Makov, G.

AU - Venkert, A.

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Y1 - 2009/12/1

N2 - The effect of strain on the microstructure and detailed internal structure of dislocation boundaries in pure polycrystalline fcc metals (aluminum, copper, nickel and gold) was systematically studied and compared as a function of strain following compression at room temperature. At low strains all metals form a cellular structure. The dislocations in the cell walls tend to rearrange themselves from tangles to ordered arrays of parallel dislocations as the strain is increased. However the rearrangement does not correlate well with the stacking fault energy. A good correlation is found with the cross-slip activation energy.

AB - The effect of strain on the microstructure and detailed internal structure of dislocation boundaries in pure polycrystalline fcc metals (aluminum, copper, nickel and gold) was systematically studied and compared as a function of strain following compression at room temperature. At low strains all metals form a cellular structure. The dislocations in the cell walls tend to rearrange themselves from tangles to ordered arrays of parallel dislocations as the strain is increased. However the rearrangement does not correlate well with the stacking fault energy. A good correlation is found with the cross-slip activation energy.

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U2 - 10.1088/1757-899X/3/1/012004

DO - 10.1088/1757-899X/3/1/012004

M3 - Conference article

AN - SCOPUS:84893452410

SN - 1757-8981

VL - 3

JO - IOP Conference Series: Materials Science and Engineering

JF - IOP Conference Series: Materials Science and Engineering

M1 - 012004

T2 - 3rd International Conference on the Fundamentals of Plastic Deformation, DISLOCATIONS 2008

Y2 - 13 October 2008 through 17 October 2008

ER -

Evolution of dislocation patterns in fcc metals

Abstract

ASJC Scopus subject areas

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