Fin Reveal RIE Process Investigation

Chunpui Kwan; Hongliang Shen; Edward Reis; Cassidy Dineen; Tu Q. Nguyen; Lillian Li; Yevgeny Lifshitz; Robert Brown; Lan Yang; Xiaoli He; James Chen

doi:10.1109/ASMC57536.2023.10121135

Fin Reveal RIE Process Investigation

Chunpui Kwan, Hongliang Shen, Edward Reis, Cassidy Dineen, Tu Q. Nguyen, Lillian Li, Yevgeny Lifshitz, Robert Brown, Lan Yang, Xiaoli He, James Chen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Oxide selectivity at Fin reveal dry etching is studied by varying the CxFy gas flow and etch time. Defectivity and yield of the resulting FinFET devices are compared. Also, a new detection method is evaluated for early warnings of defects due to oxide selectivity. Such learning may improve the efficiency of enhanced performance FinFET devices and reduce fabrication cost.

Original language	English
Title of host publication	2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2023
Publisher	Institute of Electrical and Electronics Engineers
ISBN (Electronic)	9781665456395
DOIs	https://doi.org/10.1109/ASMC57536.2023.10121135
State	Published - 1 Jan 2023
Externally published	Yes
Event	34th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2023 - Saratoga Springs, United States Duration: 1 May 2023 → 4 May 2023

Publication series

Name	ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings
Volume	2023-May
ISSN (Print)	1078-8743

Conference

Conference	34th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2023
Country/Territory	United States
City	Saratoga Springs
Period	1/05/23 → 4/05/23

Keywords

Fin Reveal
FinFET
Inline Detection
Oxide Residue
Plasma Etch
RIE

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
General Engineering
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/ASMC57536.2023.10121135

Cite this

Kwan, C., Shen, H., Reis, E., Dineen, C., Nguyen, T. Q., Li, L., Lifshitz, Y., Brown, R., Yang, L., He, X., & Chen, J. (2023). Fin Reveal RIE Process Investigation. In 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2023 (ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings; Vol. 2023-May). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ASMC57536.2023.10121135

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title = "Fin Reveal RIE Process Investigation",

abstract = "Oxide selectivity at Fin reveal dry etching is studied by varying the CxFy gas flow and etch time. Defectivity and yield of the resulting FinFET devices are compared. Also, a new detection method is evaluated for early warnings of defects due to oxide selectivity. Such learning may improve the efficiency of enhanced performance FinFET devices and reduce fabrication cost.",

keywords = "Fin Reveal, FinFET, Inline Detection, Oxide Residue, Plasma Etch, RIE",

author = "Chunpui Kwan and Hongliang Shen and Edward Reis and Cassidy Dineen and Nguyen, \{Tu Q.\} and Lillian Li and Yevgeny Lifshitz and Robert Brown and Lan Yang and Xiaoli He and James Chen",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 34th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2023 ; Conference date: 01-05-2023 Through 04-05-2023",

year = "2023",

month = jan,

day = "1",

doi = "10.1109/ASMC57536.2023.10121135",

language = "English",

series = "ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings",

publisher = "Institute of Electrical and Electronics Engineers",

booktitle = "2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2023",

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}

Kwan, C, Shen, H, Reis, E, Dineen, C, Nguyen, TQ, Li, L, Lifshitz, Y, Brown, R, Yang, L, He, X & Chen, J 2023, Fin Reveal RIE Process Investigation. in 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2023. ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings, vol. 2023-May, Institute of Electrical and Electronics Engineers, 34th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2023, Saratoga Springs, United States, 1/05/23. https://doi.org/10.1109/ASMC57536.2023.10121135

Fin Reveal RIE Process Investigation. / Kwan, Chunpui; Shen, Hongliang; Reis, Edward et al.
2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2023. Institute of Electrical and Electronics Engineers, 2023. (ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings; Vol. 2023-May).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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T1 - Fin Reveal RIE Process Investigation

AU - Kwan, Chunpui

AU - Shen, Hongliang

AU - Reis, Edward

AU - Dineen, Cassidy

AU - Nguyen, Tu Q.

AU - Li, Lillian

AU - Lifshitz, Yevgeny

AU - Brown, Robert

AU - Yang, Lan

AU - He, Xiaoli

AU - Chen, James

PY - 2023/1/1

Y1 - 2023/1/1

N2 - Oxide selectivity at Fin reveal dry etching is studied by varying the CxFy gas flow and etch time. Defectivity and yield of the resulting FinFET devices are compared. Also, a new detection method is evaluated for early warnings of defects due to oxide selectivity. Such learning may improve the efficiency of enhanced performance FinFET devices and reduce fabrication cost.

AB - Oxide selectivity at Fin reveal dry etching is studied by varying the CxFy gas flow and etch time. Defectivity and yield of the resulting FinFET devices are compared. Also, a new detection method is evaluated for early warnings of defects due to oxide selectivity. Such learning may improve the efficiency of enhanced performance FinFET devices and reduce fabrication cost.

KW - Fin Reveal

KW - FinFET

KW - Inline Detection

KW - Oxide Residue

KW - Plasma Etch

KW - RIE

UR - https://www.scopus.com/pages/publications/85159756649

U2 - 10.1109/ASMC57536.2023.10121135

DO - 10.1109/ASMC57536.2023.10121135

M3 - Conference contribution

AN - SCOPUS:85159756649

T3 - ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

BT - 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2023

PB - Institute of Electrical and Electronics Engineers

T2 - 34th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2023

Y2 - 1 May 2023 through 4 May 2023

ER -

Fin Reveal RIE Process Investigation

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Access to Document

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