From fuzziness to robustness - A multi-filament fiber model

Erez Manor

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Whiskers or fibers can contribute to the strength of bonding layers of electronic and opto-electronic packaging. A model of polymeric bonding layer containing fibers is studied. The reliability of filaments, such as carbon whiskers or nano-tubes, under tensile stress, is characterized by a strength probability distribution with high variance, leading to reliability fuzziness. One of quality engineering's goals is to minimize such fuzziness. Splitting the whisker into numerous smaller whiskers reaches this goal. The intact state becomes multi-state instead of single-state, where complete failure happens when all small whiskers fail. Such multi-state introduces fuzziness into the reliability state of the fiber. We show the increase in internal failure fuzziness reduces the overall reliability fuzziness. Analytical and simulation results demonstrate two special modes of loading: static loading, in which whiskers collapse sequentially under one load, and dynamic loading by repetitive shocks (load pulses) that cause aging of the fiber. The conclusion is that division into smaller whiskers may weaken the fiber but reduce the reliability fuzziness.

Original languageEnglish
Title of host publicationPORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conf. Polymers and Adhesives in Microelectronics and Photonics
DOIs
StatePublished - 1 Dec 2008
Externally publishedYes
Event2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, PORTABLE-POLYTRONIC 2008 - Garmisch-Partenkirchen, Germany
Duration: 17 Aug 200820 Aug 2008

Publication series

NamePORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photon

Conference

Conference2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, PORTABLE-POLYTRONIC 2008
Country/TerritoryGermany
CityGarmisch-Partenkirchen
Period17/08/0820/08/08

Keywords

  • Material reliability
  • Packaging
  • Reliability modeling
  • Simulation

ASJC Scopus subject areas

  • Information Systems
  • Electronic, Optical and Magnetic Materials
  • Polymers and Plastics
  • Surfaces, Coatings and Films

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