TY - GEN
T1 - Functionally graded Bi2Te3 based material for above ambient temperature application
AU - Ben-Yehuda, O.
AU - Gelbstein, Y.
AU - Dashevsky, Z.
AU - George, Y.
AU - Dariel, M. P.
PY - 2007/12/1
Y1 - 2007/12/1
N2 - This study is concerned with the preparation of Bi0.4Sb 1.6Te3 Functionally Graded (FG) samples by a powder metallurgical approach for above ambient temperature applications. The FG sample is based on two components with different carrier concentration. The first is designed for a maximal figure of merit at room temperature, the second, doped with Pb, is meant for operation at higher temperatures. The transport properties of the two components of the FG sample, namely the Seebeck coefficient and electrical resistivity, have been determined from room temperature up to 550 K. The preparation of FG samples, their chemical stability and their transport properties over this temperatures range were examined and will be discussed.
AB - This study is concerned with the preparation of Bi0.4Sb 1.6Te3 Functionally Graded (FG) samples by a powder metallurgical approach for above ambient temperature applications. The FG sample is based on two components with different carrier concentration. The first is designed for a maximal figure of merit at room temperature, the second, doped with Pb, is meant for operation at higher temperatures. The transport properties of the two components of the FG sample, namely the Seebeck coefficient and electrical resistivity, have been determined from room temperature up to 550 K. The preparation of FG samples, their chemical stability and their transport properties over this temperatures range were examined and will be discussed.
UR - http://www.scopus.com/inward/record.url?scp=51849136957&partnerID=8YFLogxK
U2 - 10.1109/ICT.2007.4569429
DO - 10.1109/ICT.2007.4569429
M3 - Conference contribution
AN - SCOPUS:51849136957
SN - 9781424422623
T3 - International Conference on Thermoelectrics, ICT, Proceedings
SP - 82
EP - 85
BT - Proceedings ICT'07 - 26th International Conference on Thermoelectrics
T2 - ICT'07 - 26th International Conference on Thermoelectrics
Y2 - 3 June 2007 through 7 June 2007
ER -