Abstract
An electroless process for depositing gold (Au0) from a solution, comprising allowing gold (Au0) place from a solution of gold thiocyanate complex dissolved in a mixture of water-miscible organic solvent and water, or the deposition of gold (Au0) takes place on a deposition-directing layer comprising positively charged organic groups, said layer being provided on at least a portion of a surface of a substrate sought to be gold-coated.
Original language | English |
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Patent number | US2015345025 |
IPC | C23C 18/ 16 A I |
Priority date | 10/11/13 |
State | Published - 3 Dec 2015 |