Abstract
An electroless process for depositing gold (Au0) from a solution, comprising allowing gold (Au0) place from a solution of gold thiocyanate complex dissolved in a mixture of water-miscible organic solvent and water, or the deposition of gold (Au0) takes place on a deposition-directing layer comprising positively charged organic groups, said layer being provided on at least a portion of a surface of a substrate sought to be gold-coated.
| Original language | English |
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| Patent number | WO2014072969 |
| IPC | B05D 5/ 12 A I |
| Priority date | 11/06/13 |
| State | Published - 15 May 2014 |