Hurdles in the implementation of compressive sensing for imaging and ways to overcome them

Adrian Stern, Isaac Y. August, Yaniv Oiknine

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    2 Scopus citations

    Abstract

    The theory of compressive sensing (CS) has opened up new opportunities in the field of imaging. However, its implementation in this field is often not straight-forward and the optical imaging system engineer encounters several hurdles on the way of compressive imaging (CI) realization. The principles of CI design may differ drastically from the principles used for conventional imaging. Analytical tools developed for conventional imaging may not be optimal for compressive imaging. Nor are the conventional imaging components. Therefore often the CI designer needs to develop new tools, and imaging schemes. In this paper we overview the main challenges that might arise in the design of compressive imaging systems. The challenges are demonstrated through four tasks and systems: compressive two dimensional (2D) imager, compressive motion detection, compressive spectral imaging and compressive holography.

    Original languageEnglish
    Title of host publicationComputational Imaging
    EditorsKenneth S. Kubala, Lei Tian, Abhijit Mahalanobis, Amit Ashok, Jonathan C. Petruccelli
    PublisherSPIE
    ISBN (Electronic)9781510601116
    DOIs
    StatePublished - 1 Jan 2016
    EventComputational Imaging - Baltimore, United States
    Duration: 17 Apr 201618 Apr 2016

    Publication series

    NameProceedings of SPIE - The International Society for Optical Engineering
    Volume9870
    ISSN (Print)0277-786X
    ISSN (Electronic)1996-756X

    Conference

    ConferenceComputational Imaging
    Country/TerritoryUnited States
    CityBaltimore
    Period17/04/1618/04/16

    Keywords

    • Compressive imaging
    • Compressive sensing
    • Holography
    • Spectral imaging

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Computer Science Applications
    • Applied Mathematics
    • Electrical and Electronic Engineering

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