TY - GEN
T1 - Identification of process window limiting structures by design-based defect binning
AU - Vasek, Jim
AU - Nehmadi, Youval
AU - Svidenko, Vicky
AU - Shimshi, Rinat
PY - 2007/10/1
Y1 - 2007/10/1
N2 - A new methodology is presented for identifying misprinted structures during the qualification of a new photomask. It is based on defect inspection of a focus- and exposure-modulated wafer. Instead of the traditional approach which employs repeater analysis, the new technique bins the defect locations according to the design structures where they occur and assigns them a criticality factor. This method allows for efficient data reduction and prioritization of suspect sites, leading to identification of marginally-printed structures within the patterning process window.
AB - A new methodology is presented for identifying misprinted structures during the qualification of a new photomask. It is based on defect inspection of a focus- and exposure-modulated wafer. Instead of the traditional approach which employs repeater analysis, the new technique bins the defect locations according to the design structures where they occur and assigns them a criticality factor. This method allows for efficient data reduction and prioritization of suspect sites, leading to identification of marginally-printed structures within the patterning process window.
UR - https://www.scopus.com/pages/publications/34748819904
U2 - 10.1109/ASMC.2007.375104
DO - 10.1109/ASMC.2007.375104
M3 - Conference contribution
AN - SCOPUS:34748819904
SN - 1424406536
SN - 9781424406531
T3 - ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings
SP - 153
EP - 156
BT - 2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC
T2 - 2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC
Y2 - 11 June 2007 through 12 June 2007
ER -