Spall experiments have been carried out for copper in different structural states. The samples were copper single crystals, crystals of Cu + 0.1% Si, copper crystals with silica particles of 180 nm average size, and polycrystalline copper. In experiments, the free surface velocity histories were recorded with the VISAR. The recovered samples were studied using optical microscopy and SEM. Solid solution Cu + 0.1% Si demonstrates slower spall process than pure copper crystals. At longer pulse durations its spall strength is slightly less than that of pure crystals but approaches the latter with decreasing pulse duration. Fracture of copper with silica inclusions is completed much faster. The spall strength of this material is close to that of Cu + 0.1% Si crystals at longer pulse duration and approaches the strength of polycrystalline copper with decreasing the load duration. Fractography of the spall surfaces correlates with the free surface velocity histories. The main fracture surface of the Cu + 0.1/oSi grains consists of net of dimples ∼4 μm to 40 μm mean diameter. The fracture surfaces of copper with silica inclusions is covered by a net of dimples of 1 μm to 5 μm size.