TY - GEN
T1 - Inside 6th gen Intel® Core™
T2 - 28th IEEE Hot Chips Symposium, HCS 2016
AU - Anati, Ittai
AU - Blythe, David
AU - Doweck, Jack
AU - Jiang, Hong
AU - Kao, Wen Fu
AU - Mandelblat, Julius
AU - Rappoport, Lihu
AU - Rotem, Efraim
AU - Yasin, Ahmad
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2017/5/30
Y1 - 2017/5/30
N2 - •Skylake delivers record levels of performance and battery life in many personal computing use cases and form factors •Intel® Speed Shift Technology provides higher performance, responsiveness and efficiency at power constrained form factors •Skylake Processor Graphics delivers scalable performance, >1TFLOPS compute, enhanced low power media engines, flexible power management, and end-to-end 4K experience •Skylake family of products allows developers to: •Choose from wide range of platform capabilities •Innovate with products for wide range of thermal envelopes and I/O solutions •Optimize the system performance using the advanced PMU capabilities •Skylake introduces Intel® SGX: a revolutionary game changer to trusted application security in the main stream SW environment.
AB - •Skylake delivers record levels of performance and battery life in many personal computing use cases and form factors •Intel® Speed Shift Technology provides higher performance, responsiveness and efficiency at power constrained form factors •Skylake Processor Graphics delivers scalable performance, >1TFLOPS compute, enhanced low power media engines, flexible power management, and end-to-end 4K experience •Skylake family of products allows developers to: •Choose from wide range of platform capabilities •Innovate with products for wide range of thermal envelopes and I/O solutions •Optimize the system performance using the advanced PMU capabilities •Skylake introduces Intel® SGX: a revolutionary game changer to trusted application security in the main stream SW environment.
UR - https://www.scopus.com/pages/publications/85025815903
U2 - 10.1109/HOTCHIPS.2016.7936222
DO - 10.1109/HOTCHIPS.2016.7936222
M3 - Conference contribution
AN - SCOPUS:85025815903
T3 - 2016 IEEE Hot Chips 28 Symposium, HCS 2016
BT - 2016 IEEE Hot Chips 28 Symposium, HCS 2016
PB - Institute of Electrical and Electronics Engineers
Y2 - 21 August 2016 through 23 August 2016
ER -