Abstract
Wetting behavior and the interface reaction in the Y2 O3/(Cu - Al) system were investigated at 1423 K. A contact angle of about 130° was measured in the Y2O3/ Cu system. Aluminum addition to copper improves wetting and the transition from non-wetting to wetting (θ ≤ 90°) was observed for the alloy with 50 at.% Al. The microstructure examination of the interface indicates that Al reacts with yttria, yttrium dissolves in the melt and a crater of AlYO3 is formed at the substrate. The interface interaction in the Y2O3/(Cu-Al) system is in a good agreement with the results of a thermodynamic analysis in the Y-Al-Cu-O system. The crater depth and the macroscopic final contact angles are correlated with the Y and Al activities in the melt.
Original language | English |
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Pages (from-to) | 291-295 |
Number of pages | 5 |
Journal | Materials Science and Engineering: A |
Volume | 420 |
Issue number | 1-2 |
DOIs | |
State | Published - 25 Mar 2006 |
Keywords
- Aluminum
- Copper
- Thermodynamic
- Wetting
- Yttrium oxide
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering