Interstitial carbon in copper: Electronic and mechanical properties

D. E. Ellis, K. C. Mundim, D. Fuks, S. Dorfman, A. Berner

Research output: Contribution to journalArticlepeer-review

34 Scopus citations


The effects of interstitial carbon on the electronic and mechanical properties of copper are studied theoretically. Semiempirical methodology, atomistic simulations and first-principles density-functional embedded-cluster schemes are combined to extract some understanding of the diffusion process and related degradation of Cu-C composite materials under extremes of temperature and stress. High-resolution scanning electron microscopy results are presented, which demonstrate the existence of a solid solution zone at the Cu-C interface.

Original languageEnglish
Pages (from-to)1615-1630
Number of pages16
JournalPhilosophical Magazine B: Physics of Condensed Matter; Statistical Mechanics, Electronic, Optical and Magnetic Properties
Issue number10
StatePublished - 1 Jan 1999

ASJC Scopus subject areas

  • Chemical Engineering (all)
  • Physics and Astronomy (all)


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