TY - GEN
T1 - Large angle SOI tilting actuator with integrated motion transformer and amplifier
AU - Ya'akobovitz, A.
AU - Krylov, S.
AU - Shacham-Diamand, Y.
PY - 2008/8/29
Y1 - 2008/8/29
N2 - In this work we report on the novel architecture and operational principle of a tilting actuator fabricated using a single structural layer of silicon on insulator (SOI) wafer and demonstrate the functionality of the device both theoretically and experimentally. The device incorporates an integrated compliant motion amplifier realized as an eccentric elastic torsion link that transforms small out-of-plane motion of the parallel plate electrostatic transducer into large amplitude angular motion of the tilting element. A feasibility study was performed using a lumped model of the device and verified by a coupled three-dimensional simulation. Experimental and model results indicate that this generic architecture, combining simple fabrication process with robustness of SOI based devices, is efficient for static and resonant operation of various tilting micro devices.
AB - In this work we report on the novel architecture and operational principle of a tilting actuator fabricated using a single structural layer of silicon on insulator (SOI) wafer and demonstrate the functionality of the device both theoretically and experimentally. The device incorporates an integrated compliant motion amplifier realized as an eccentric elastic torsion link that transforms small out-of-plane motion of the parallel plate electrostatic transducer into large amplitude angular motion of the tilting element. A feasibility study was performed using a lumped model of the device and verified by a coupled three-dimensional simulation. Experimental and model results indicate that this generic architecture, combining simple fabrication process with robustness of SOI based devices, is efficient for static and resonant operation of various tilting micro devices.
UR - http://www.scopus.com/inward/record.url?scp=50149099192&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2008.4443699
DO - 10.1109/MEMSYS.2008.4443699
M3 - Conference contribution
AN - SCOPUS:50149099192
SN - 9781424417933
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 487
EP - 490
BT - MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems
T2 - 21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson
Y2 - 13 January 2008 through 17 January 2008
ER -