TY - JOUR
T1 - Large-Scale Integrated Photonic Device Platform for Energy-Efficient AI/ML Accelerators
AU - Tossoun, Bassem
AU - Xiao, Xian
AU - Cheung, Stanley
AU - Yuan, Yuan
AU - Peng, Yiwei
AU - Srinivasan, Sudharsanan
AU - Giamougiannis, George
AU - Huang, Zhihong
AU - Singaraju, Prerana
AU - London, Yanir
AU - Hejda, Matej
AU - Sundararajan, Sri Priya
AU - Hu, Yingtao
AU - Gong, Zheng
AU - Baek, Jongseo
AU - Descos, Antoine
AU - Kapusta, Morten
AU - Bohm, Fabian
AU - Van Vaerenbergh, Thomas
AU - Fiorentino, Marco
AU - Kurczveil, Geza
AU - Liang, Di
AU - Beausoleil, Raymond G.
N1 - Publisher Copyright:
© 1995-2012 IEEE.
PY - 2025/1/1
Y1 - 2025/1/1
N2 - The convergence of deep learning and big data has spurred significant interest in developing novel hardware that can run large artificial intelligence (AI) workloads more efficiently. Over the last several years, silicon photonics has emerged as a disruptive technology for next-generation accelerators for machine learning (ML). More recently, the heterogeneous integration of III-V compound semiconductors has opened the door to integrating lasers and semiconductor optical amplifiers at wafer-scale, enabling the scaling of the size, density, and complexity of silicon photonic integrated circuits (PICs). Furthermore, using this technology, all of the individual components required to execute the operations within a neural network are available and can be integrated on the same PIC. Here, we review our innovations of an energy-efficient and scalable silicon photonic platform serving as the underlying foundation for next-generation AI accelerator hardware.
AB - The convergence of deep learning and big data has spurred significant interest in developing novel hardware that can run large artificial intelligence (AI) workloads more efficiently. Over the last several years, silicon photonics has emerged as a disruptive technology for next-generation accelerators for machine learning (ML). More recently, the heterogeneous integration of III-V compound semiconductors has opened the door to integrating lasers and semiconductor optical amplifiers at wafer-scale, enabling the scaling of the size, density, and complexity of silicon photonic integrated circuits (PICs). Furthermore, using this technology, all of the individual components required to execute the operations within a neural network are available and can be integrated on the same PIC. Here, we review our innovations of an energy-efficient and scalable silicon photonic platform serving as the underlying foundation for next-generation AI accelerator hardware.
KW - heterogeneous integration
KW - memristors
KW - neuromorphic computing
KW - optical computing
KW - silicon photonics
UR - http://www.scopus.com/inward/record.url?scp=85214847690&partnerID=8YFLogxK
U2 - 10.1109/JSTQE.2025.3527904
DO - 10.1109/JSTQE.2025.3527904
M3 - Article
AN - SCOPUS:85214847690
SN - 1077-260X
JO - IEEE Journal of Selected Topics in Quantum Electronics
JF - IEEE Journal of Selected Topics in Quantum Electronics
ER -