TY - GEN
T1 - M-FOUP SYSTEM performance in a semiconductor process control
AU - Lifshitz, Yevgeny
AU - Alhasawi, Fahad
AU - Novack, David
AU - Downey, Jack
AU - Byrnes, John
AU - Hajtman, Alfred
AU - Nandor Bitvai, Csaba
AU - Bolcskei-Molnar, Anna
AU - Nemeth, Istvan
AU - Kover, Krisztina
AU - Basa, Peter
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023/1/1
Y1 - 2023/1/1
N2 - The metrology FOUP (M-FOUP) is a custom-modified wafer carrier equipped with multi-point spectroscopic reflectometer metrology. The self-powered metrology apparatus is positioned above a FOUP slot holding the wafer to be measured. The measured points on the wafer are fixed by placing fiber probes on a permanent mounting plate. The measured reflectometry spectrums are analyzed based on optical modeling software. The M-FOUP SYSTEM consists of a controller (M-CONTROLLER), which controls multiple M-FOUP measurement units.In our previous publications, we focused on the technical details of the M-FOUP unit, such as the overall design, internal temperature distribution, and charging/discharging routine, as well as on the metrology job architecture and implementation of this unique concept into an operating fab environment. In this work, we compare the performance of the M-FOUP SYSTEM with the Process of Record (POR) metrology for typical high-volume applications.
AB - The metrology FOUP (M-FOUP) is a custom-modified wafer carrier equipped with multi-point spectroscopic reflectometer metrology. The self-powered metrology apparatus is positioned above a FOUP slot holding the wafer to be measured. The measured points on the wafer are fixed by placing fiber probes on a permanent mounting plate. The measured reflectometry spectrums are analyzed based on optical modeling software. The M-FOUP SYSTEM consists of a controller (M-CONTROLLER), which controls multiple M-FOUP measurement units.In our previous publications, we focused on the technical details of the M-FOUP unit, such as the overall design, internal temperature distribution, and charging/discharging routine, as well as on the metrology job architecture and implementation of this unique concept into an operating fab environment. In this work, we compare the performance of the M-FOUP SYSTEM with the Process of Record (POR) metrology for typical high-volume applications.
KW - Advanced Metrology
KW - Design Enablement
KW - Device Development
KW - Fab-integrated metrology
KW - M-FOUP SYSTEM
KW - film thickness
UR - https://www.scopus.com/pages/publications/85159759713
U2 - 10.1109/ASMC57536.2023.10121086
DO - 10.1109/ASMC57536.2023.10121086
M3 - Conference contribution
AN - SCOPUS:85159759713
T3 - ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings
BT - 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2023
PB - Institute of Electrical and Electronics Engineers
T2 - 34th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2023
Y2 - 1 May 2023 through 4 May 2023
ER -