Magnetic and structural properties of electrodeposited copper-nickel microlayered alloys

D. S. Lashmore, R. R. Oberle, L. H. Bennett, L. J. Swartzendruber, U. Atzmony, M. P. Dariel, L. Romankiw

Research output: Contribution to journalConference articlepeer-review

7 Scopus citations

Abstract

Magnetic measurements of Ni-Cu compositionally alloys prepared by electrochemical deposition suggest a high degree of perfection is achieved. The magnetic behavior closely resembles that of bulk nickel and suggests little interdiffusion between the copper and the nickel. The high value of the saturation magnetization implies that no magnetic dead layer exists at the nickel/copper interface for wavelengths greater than 2.5 nm. A magnetic after effect has been found which increases with decreasing temperature and is a maximum at the coercive field. The electrochemical technique has progressed to the point where third order satellites are now commonly observed, suggesting a very square composition profile. Continuous layers of copper as thin as .2 nm have been produced.

Original languageEnglish
Pages (from-to)347-357
Number of pages11
JournalProceedings - The Electrochemical Society
Volume90
Issue number8
StatePublished - 1 Dec 1990
Externally publishedYes
EventProceedings of the Symposium on Magnetic Materials, Processes, and Devices (as part of the 176th Meeting of the Electrochemical Society) - Hollywood, FL, USA
Duration: 15 Oct 198919 Oct 1989

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