Manufacturing considerations for implementation of scatterometry for process monitoring

John Allgair, Dave Benoit, Rob Hershey, Lloyd C. Litt, Ibrahim Abdulhalim, Bill Braymer, Michael Faeyrman, John C. Robinson, Umar Whitney, Yiping Xu, Piotr Zalicki, Joel Seligson

Research output: Contribution to journalConference articlepeer-review

38 Scopus citations


The continuing demand for higher frequency microprocessors and larger memory arrays has led to decreasing device dimensions and smaller process control windows. Decreasing process control windows have created a need for higher precision metrology to maintain an acceptable precision to tolerance ratio with a reasonable sampling rate. In order to determine and reduce across chip, across wafer, and across lot linewidth variations, higher sampling is required which, in turn, demands faster move acquire measure (MAM) times to maintain throughput. Finally, the need to detect and quantify sidewall angle changes in addition to CD measurements is becoming critical. Spectroscopic Scatterometry is a metrology technique which offers the potential to meet these requirements. This work explores some of the fundamental technology concerns for implementing scatterometry in a manufacturing environment. These concerns include mark requirements and characterization necessary for library generation. Comparison of scatterometry data to in-line CD SEM, x-section SEM, and AFM results will be presented.

Original languageEnglish
Pages (from-to)125-134
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
StatePublished - 1 Jan 2000
Externally publishedYes
EventMetrology, Inspection, and Process Control for Microlithography XIV - Santa Clara, CA, USA
Duration: 28 Feb 20002 Mar 2000

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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