Measurement of elastic and thermal properties of composite materials using digital speckle pattern interferometry

Manoj Kumar, Gufran S. Khan, Chandra Shakher

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

18 Scopus citations

Abstract

In the present work, application of digital speckle pattern interferometry (DSPI) was applied for the measurement of mechanical/elastic and thermal properties of fibre reinforced plastics (FRP). Digital speckle pattern interferometric technique was used to characterize the material constants (Poisson's ratio and Young's modulus) of the composite material. Poisson ratio based on plate bending and Young's modulus based on plate vibration of material are measured by using DSPI. In addition to this, the coefficient of thermal expansion of composite material is also measured. To study the thermal strain analysis, a single DSPI fringe pattern is used to extract the phase information by using Riesz transform and the monogenic signal. The phase extraction from a single DSPI fringe pattern by using Riesz transform does not require a phase-shifting system or spatial carrier. The elastic and thermal parameters obtained from DSPI are in close agreement with the theoretical predictions available in literature.

Original languageEnglish
Title of host publicationSPECKLE 2015
Subtitle of host publicationVI International Conference on Speckle Metrology
EditorsFernando Mendoza Santoyo, Eugenio R. Mendez
PublisherSPIE
ISBN (Electronic)9781628418781
DOIs
StatePublished - 1 Jan 2015
Externally publishedYes
Event6th International Conference on Speckle Metrology, SPECKLE 2015 - Guanajuato, Mexico
Duration: 24 Aug 201526 Aug 2015

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume9660
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

Conference6th International Conference on Speckle Metrology, SPECKLE 2015
Country/TerritoryMexico
CityGuanajuato
Period24/08/1526/08/15

Keywords

  • Composite material
  • Digital speckle pattern interferometry
  • Mode shape
  • Plate vibration
  • Poisson's ratio
  • Thermal expansion coefficient
  • Young's modulus

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Measurement of elastic and thermal properties of composite materials using digital speckle pattern interferometry'. Together they form a unique fingerprint.

Cite this