TY - GEN
T1 - Method for fast and accurate calibration of litho simulator for hot spot analysis
AU - Jank, Stefan
AU - Temchenko, Vlad
AU - Karakatsanis, Paul G.
AU - Veerasingam, Ramana
AU - Vallishayee, Rakesh
AU - Dolainsky, Christoph
AU - Yang, Xiaojing
AU - Choi, Bong Ryoul
AU - Nehmadi, Youval
AU - Poyastro, Moshe
PY - 2006/12/1
Y1 - 2006/12/1
N2 - Deploying OPC that is robust over the process window is becoming more and more challenging as geometries shrinki ii. This challenge has a major impact in time-to-market and yield of new products. This paper describes a litho simulator calibration flow using a streamlined OPC verification methodology. This new methodology successfully bridges design and manufacturing to accelerate the OPC development process and proactively identifies weak OPC locations that can reduce yield. The method includes an accurate simulator calibration using automatically obtained 'on silicon' measurement data, followed by full-chip litho simulation using the calibrated model to identify potential hot spots on product. The method also enabled a short cycle feedback loop to the OPC model generation resulting in improved OPC optimization and verification.
AB - Deploying OPC that is robust over the process window is becoming more and more challenging as geometries shrinki ii. This challenge has a major impact in time-to-market and yield of new products. This paper describes a litho simulator calibration flow using a streamlined OPC verification methodology. This new methodology successfully bridges design and manufacturing to accelerate the OPC development process and proactively identifies weak OPC locations that can reduce yield. The method includes an accurate simulator calibration using automatically obtained 'on silicon' measurement data, followed by full-chip litho simulation using the calibrated model to identify potential hot spots on product. The method also enabled a short cycle feedback loop to the OPC model generation resulting in improved OPC optimization and verification.
UR - http://www.scopus.com/inward/record.url?scp=37749029247&partnerID=8YFLogxK
U2 - 10.1109/ISSM.2006.4493134
DO - 10.1109/ISSM.2006.4493134
M3 - Conference contribution
AN - SCOPUS:37749029247
SN - 9784990413804
T3 - IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
SP - 453
EP - 456
BT - ISSM 2006 Conference Proceedings - Fifteenth International Symposium on Semiconductor Manufacturing
T2 - ISSM 2006 - 15th International Symposium on Semiconductor Manufacturing
Y2 - 25 September 2007 through 27 September 2007
ER -