Methods and systems for determining a critical dimension and overlay of a specimen

Ady Levy; Kyle A Brown; Rodney Smedt; Gary Bultman; Mehrdad Nikoonahad; Dan Wack; John Fielden; Ibrahim Abdulhalim

Methods and systems for determining a critical dimension and overlay of a specimen

Ady Levy (Inventor), Kyle A Brown (Inventor), Rodney Smedt (Inventor), Gary Bultman (Inventor), Mehrdad Nikoonahad (Inventor), Dan Wack (Inventor), John Fielden (Inventor), Ibrahim Abdulhalim (Inventor)

Research output: Patent

Abstract

Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and overlay misregistration. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Original language	English
Patent number	US2004235205
IPC	H01L 21/ 66 A I
Priority date	27/03/03
State	Published - 25 Nov 2004

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@misc{5d95b62f4e9d4a5e80e9dbcd1e6d70ce,

title = "Methods and systems for determining a critical dimension and overlay of a specimen",

abstract = "Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and overlay misregistration. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.",

author = "Ady Levy and Brown, {Kyle A} and Rodney Smedt and Gary Bultman and Mehrdad Nikoonahad and Dan Wack and John Fielden and Ibrahim Abdulhalim",

year = "2004",

month = nov,

day = "25",

language = "English",

type = "Patent",

note = "US2004235205; H01L 21/ 66 A I",

}

TY - PAT

T1 - Methods and systems for determining a critical dimension and overlay of a specimen

AU - Levy, Ady

AU - Brown, Kyle A

AU - Smedt, Rodney

AU - Bultman, Gary

AU - Nikoonahad, Mehrdad

AU - Wack, Dan

AU - Fielden, John

AU - Abdulhalim, Ibrahim

PY - 2004/11/25

Y1 - 2004/11/25

N2 - Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and overlay misregistration. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

AB - Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and overlay misregistration. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

M3 - Patent

M1 - US2004235205

ER -

Methods and systems for determining a critical dimension and overlay of a specimen

Abstract

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