Microstructure evolution in deformed copper and nickel

Peri Landau, Roni Z. Shneck, Guy Makov, Arie Venkert

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

The combined effect of strain and temperature on the microstructure and detailed internal structure of dislocation boundaries was systematically studied in compressed pure polycrystalline copper and nickel and compared to the microstructure of compressed polycrystalline aluminum. Below 0.5Tm the microstructure of Cu and Ni consists of dislocation cells, however, only in Cu second generation microbands are formed. In Cu and Ni, the dislocations inside the boundaries rearrange themselves from tangles to ordered arrays of parallel dislocations following interplay between strain (requirement for cross slip) and temperature (dislocation mobility and ease of cross slip). The ordered detailed structure is similar to that observed in Al deformed at room temperature and lower strain levels. The amount of strain and temperature applied to Cu and Ni in order to achieve the same detailed structure formed in Al depends on the stacking fault energy (SFE) of the metal- higher strain and temperature as the SFE is lower.

Original languageEnglish
Title of host publicationElectron Microscopy Across Hard and Soft Materials
PublisherMaterials Research Society
Pages31-36
Number of pages6
ISBN (Print)9781604234299
DOIs
StatePublished - 1 Jan 2006
Event2006 MRS Fall Meeting - Boston, MA, United States
Duration: 27 Nov 20061 Dec 2006

Publication series

NameMaterials Research Society Symposium Proceedings
Volume982
ISSN (Print)0272-9172

Conference

Conference2006 MRS Fall Meeting
Country/TerritoryUnited States
CityBoston, MA
Period27/11/061/12/06

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