Monte Carlo Thermal Optimization of Populated Printed Circuit Board

Rami Eliasi, Tov Elperin

Research output: Contribution to journalArticlepeer-review

17 Scopus citations


The methodology and results of a Monte Carlo optimization of component placement on a printed circuit board are presented. The overall reliability of the component mix on the printed circuit board is the criterion of optimality. Arrhenius relations are used to quantify the effect of temperature on the component failure rate. The finite element code ANSYS is used to determine the temperature distribution in two conductively cooled printed circuit boards. The various strategies of the Monte Carlo annealing and cluster optimization methods and the effect of the relevant parameters on board reliability are discussed.

Original languageEnglish
Pages (from-to)953-960
Number of pages8
JournalIEEE Transactions on Components, Hybrids and Manufacturing Technology
Issue number4
StatePublished - 1 Jan 1990

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • General Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering


Dive into the research topics of 'Monte Carlo Thermal Optimization of Populated Printed Circuit Board'. Together they form a unique fingerprint.

Cite this