Abstract
The methodology and results of a Monte Carlo optimization of component placement on a printed circuit board are presented. The overall reliability of the component mix on the printed circuit board is the criterion of optimality. Arrhenius relations are used to quantify the effect of temperature on the component failure rate. The finite-element code ANSYS is used to determine the temperature distribution in two conductively cooled printed circuit boards. The various strategies of the Monte Carlo annealing optimization and the effect of the relevant parameters on board reliability are discussed.
Original language | English |
---|---|
Pages | 74-84 |
Number of pages | 11 |
State | Published - 1 Dec 1990 |
Event | Proceedings of the 1990 Second Intersociety Conference on Thermal Phenomena in Electronic Systems - I-THERM II - Las Vegas, NV, USA Duration: 23 May 1990 → 25 May 1990 |
Conference
Conference | Proceedings of the 1990 Second Intersociety Conference on Thermal Phenomena in Electronic Systems - I-THERM II |
---|---|
City | Las Vegas, NV, USA |
Period | 23/05/90 → 25/05/90 |
ASJC Scopus subject areas
- General Engineering