Monte Carlo thermal optimization of populated printed circuit board

R. Eliasi, T. Elperin, A. Bar-Cohen

Research output: Contribution to conferencePaperpeer-review

4 Scopus citations

Abstract

The methodology and results of a Monte Carlo optimization of component placement on a printed circuit board are presented. The overall reliability of the component mix on the printed circuit board is the criterion of optimality. Arrhenius relations are used to quantify the effect of temperature on the component failure rate. The finite-element code ANSYS is used to determine the temperature distribution in two conductively cooled printed circuit boards. The various strategies of the Monte Carlo annealing optimization and the effect of the relevant parameters on board reliability are discussed.

Original languageEnglish
Pages74-84
Number of pages11
StatePublished - 1 Dec 1990
EventProceedings of the 1990 Second Intersociety Conference on Thermal Phenomena in Electronic Systems - I-THERM II - Las Vegas, NV, USA
Duration: 23 May 199025 May 1990

Conference

ConferenceProceedings of the 1990 Second Intersociety Conference on Thermal Phenomena in Electronic Systems - I-THERM II
CityLas Vegas, NV, USA
Period23/05/9025/05/90

ASJC Scopus subject areas

  • General Engineering

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