Abstract
Granular Ti1-xNbxN thin films, 0 ≤ x ≤ 0.77, were deposited on borosilicate glass substrates by RF magnetron sputtering. Conductive-atomic force microscopy (C-AFM) was employed to study the local electrical transport properties of Ti1-xNbxN thin films. Topography images reveal that the grain size in the films increased from 30 to 90 nm, as x increased from 0 to 0.77. For a constant applied voltage of 1 V, the local leakage current in Ti1-xNbxN films increased with an increase in x value. The measured current is in the order of nA and its flow is filamentary in nature. Current-voltage characteristics measured at different locations on each current image revealed that the local resistance drastically decreased with an increase in Nb concentration. Electron-grain boundary scattering and the presence of native oxide states are responsible for the increase in the local electrical resistance of the films.
Original language | English |
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Pages (from-to) | 1938-1943 |
Number of pages | 6 |
Journal | Physica Status Solidi (A) Applications and Materials Science |
Volume | 210 |
Issue number | 9 |
DOIs | |
State | Published - 1 Sep 2013 |
Externally published | Yes |
Keywords
- conductive-atomic force microscopy
- conductivity
- grain boundary scattering
- sputtering
- titanium nitride thin film
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering
- Materials Chemistry