Skip to main navigation Skip to search Skip to main content

Neural Object Detection for 4D-STEM: High-Throughput Sub-Pixel Electron Diffraction Pattern Recognition

  • Arda Genc
  • , Ravit Silverstein

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

High-throughput analysis of multidimensional transmission electron microscopy (TEM) datasets remains a significant challenge, restricting TEM's broader applicability in strategic materials research. Conventional workflows typically involve sequential, modular processing steps that necessitate extensive manual intervention and offline parameter tuning. In this work, we introduce an end-to-end post-processing framework for large-scale four-dimensional scanning transmission electron microscopy (4D-STEM) datasets, built around a highly efficient neural network-based object detection model. Central to our method is a sub-pixel accurate object center localization algorithm, which serves as the foundation for high-precision and high-throughput analysis of electron diffraction patterns. We demonstrate a strain measurement precision of 5x10-4, quantified by the standard deviation of strain values within the strain-free Si substrate of a Si/SiGe multilayer TEM sample. Furthermore, by implementing an asynchronous, non-blocking object detection workflow, we achieve speeds exceeding 100 frames per second (fps), substantially accelerating the crystallographic phase identification and strain mapping in complex multiphase metallic alloys.

Original languageEnglish
Title of host publicationProceedings - 2025 IEEE/CVF International Conference on Computer Vision Workshops, ICCV-W 2025
PublisherInstitute of Electrical and Electronics Engineers
Pages3624-3634
Number of pages11
ISBN (Electronic)9798331589882
DOIs
StatePublished - 1 Jan 2025
Externally publishedYes
Event2025 IEEE/CVF International Conference on Computer Vision Workshops, ICCV-W 2025 - Honolulu, United States
Duration: 19 Oct 202520 Oct 2025

Publication series

NameProceedings - 2025 IEEE/CVF International Conference on Computer Vision Workshops, ICCV-W 2025

Conference

Conference2025 IEEE/CVF International Conference on Computer Vision Workshops, ICCV-W 2025
Country/TerritoryUnited States
CityHonolulu
Period19/10/2520/10/25

Keywords

  • 4d-stem
  • machine learning
  • object detection
  • strain mapping

ASJC Scopus subject areas

  • Artificial Intelligence
  • Computer Science Applications
  • Computer Vision and Pattern Recognition

Fingerprint

Dive into the research topics of 'Neural Object Detection for 4D-STEM: High-Throughput Sub-Pixel Electron Diffraction Pattern Recognition'. Together they form a unique fingerprint.

Cite this