TY - GEN
T1 - Neural Object Detection for 4D-STEM
T2 - 2025 IEEE/CVF International Conference on Computer Vision Workshops, ICCV-W 2025
AU - Genc, Arda
AU - Silverstein, Ravit
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025/1/1
Y1 - 2025/1/1
N2 - High-throughput analysis of multidimensional transmission electron microscopy (TEM) datasets remains a significant challenge, restricting TEM's broader applicability in strategic materials research. Conventional workflows typically involve sequential, modular processing steps that necessitate extensive manual intervention and offline parameter tuning. In this work, we introduce an end-to-end post-processing framework for large-scale four-dimensional scanning transmission electron microscopy (4D-STEM) datasets, built around a highly efficient neural network-based object detection model. Central to our method is a sub-pixel accurate object center localization algorithm, which serves as the foundation for high-precision and high-throughput analysis of electron diffraction patterns. We demonstrate a strain measurement precision of 5x10-4, quantified by the standard deviation of strain values within the strain-free Si substrate of a Si/SiGe multilayer TEM sample. Furthermore, by implementing an asynchronous, non-blocking object detection workflow, we achieve speeds exceeding 100 frames per second (fps), substantially accelerating the crystallographic phase identification and strain mapping in complex multiphase metallic alloys.
AB - High-throughput analysis of multidimensional transmission electron microscopy (TEM) datasets remains a significant challenge, restricting TEM's broader applicability in strategic materials research. Conventional workflows typically involve sequential, modular processing steps that necessitate extensive manual intervention and offline parameter tuning. In this work, we introduce an end-to-end post-processing framework for large-scale four-dimensional scanning transmission electron microscopy (4D-STEM) datasets, built around a highly efficient neural network-based object detection model. Central to our method is a sub-pixel accurate object center localization algorithm, which serves as the foundation for high-precision and high-throughput analysis of electron diffraction patterns. We demonstrate a strain measurement precision of 5x10-4, quantified by the standard deviation of strain values within the strain-free Si substrate of a Si/SiGe multilayer TEM sample. Furthermore, by implementing an asynchronous, non-blocking object detection workflow, we achieve speeds exceeding 100 frames per second (fps), substantially accelerating the crystallographic phase identification and strain mapping in complex multiphase metallic alloys.
KW - 4d-stem
KW - machine learning
KW - object detection
KW - strain mapping
UR - https://www.scopus.com/pages/publications/105035157563
U2 - 10.1109/ICCVW69036.2025.00378
DO - 10.1109/ICCVW69036.2025.00378
M3 - Conference contribution
AN - SCOPUS:105035157563
T3 - Proceedings - 2025 IEEE/CVF International Conference on Computer Vision Workshops, ICCV-W 2025
SP - 3624
EP - 3634
BT - Proceedings - 2025 IEEE/CVF International Conference on Computer Vision Workshops, ICCV-W 2025
PB - Institute of Electrical and Electronics Engineers
Y2 - 19 October 2025 through 20 October 2025
ER -