Package simulations for mitigating noise coupling onto sensitive RF signals

As the current "Internet of Things" trend continues to grow, SoC vendors seek robust integration of wireless RF technologies into the SoC. Wireless interfaces are influenced to a great extent by digital noise, which can couple onto the RF signals. This paper presents a reliable methodology for analyzing the noise coupling mechanism in an IC package and presents ways to minimize that noise once it is found to be out of spec. The flow uses 3D field solver, circuit simulator and mathematical calculations. Successful noise coupling simulations reduce die and package manufacturing iterations and minimize lab validation time.