Package simulations for mitigating noise coupling onto sensitive RF signals

Dmitry Fliter; Nir Malka

Package simulations for mitigating noise coupling onto sensitive RF signals

Dmitry Fliter
, Nir Malka

Research output: Contribution to conference › Paper › peer-review

Abstract

As the current "Internet of Things" trend continues to grow, SoC vendors seek robust integration of wireless RF technologies into the SoC. Wireless interfaces are influenced to a great extent by digital noise, which can couple onto the RF signals. This paper presents a reliable methodology for analyzing the noise coupling mechanism in an IC package and presents ways to minimize that noise once it is found to be out of spec. The flow uses 3D field solver, circuit simulator and mathematical calculations. Successful noise coupling simulations reduce die and package manufacturing iterations and minimize lab validation time.

Original language	English
State	Published - 1 Jan 2015
Externally published	Yes
Event	DesignCon 2015 - Santa Clara, United States Duration: 27 Jan 2015 → 30 Jan 2015

Conference

Conference	DesignCon 2015
Country/Territory	United States
City	Santa Clara
Period	27/01/15 → 30/01/15

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Cite this

@conference{03499cd50f124885a11d08d60cad9d2a,

title = "Package simulations for mitigating noise coupling onto sensitive RF signals",

abstract = "As the current {"}Internet of Things{"} trend continues to grow, SoC vendors seek robust integration of wireless RF technologies into the SoC. Wireless interfaces are influenced to a great extent by digital noise, which can couple onto the RF signals. This paper presents a reliable methodology for analyzing the noise coupling mechanism in an IC package and presents ways to minimize that noise once it is found to be out of spec. The flow uses 3D field solver, circuit simulator and mathematical calculations. Successful noise coupling simulations reduce die and package manufacturing iterations and minimize lab validation time.",

author = "Dmitry Fliter and Nir Malka",

year = "2015",

month = jan,

day = "1",

language = "English",

note = "DesignCon 2015 ; Conference date: 27-01-2015 Through 30-01-2015",

}

TY - CONF

T1 - Package simulations for mitigating noise coupling onto sensitive RF signals

AU - Fliter, Dmitry

AU - Malka, Nir

PY - 2015/1/1

Y1 - 2015/1/1

N2 - As the current "Internet of Things" trend continues to grow, SoC vendors seek robust integration of wireless RF technologies into the SoC. Wireless interfaces are influenced to a great extent by digital noise, which can couple onto the RF signals. This paper presents a reliable methodology for analyzing the noise coupling mechanism in an IC package and presents ways to minimize that noise once it is found to be out of spec. The flow uses 3D field solver, circuit simulator and mathematical calculations. Successful noise coupling simulations reduce die and package manufacturing iterations and minimize lab validation time.

AB - As the current "Internet of Things" trend continues to grow, SoC vendors seek robust integration of wireless RF technologies into the SoC. Wireless interfaces are influenced to a great extent by digital noise, which can couple onto the RF signals. This paper presents a reliable methodology for analyzing the noise coupling mechanism in an IC package and presents ways to minimize that noise once it is found to be out of spec. The flow uses 3D field solver, circuit simulator and mathematical calculations. Successful noise coupling simulations reduce die and package manufacturing iterations and minimize lab validation time.

UR - https://www.scopus.com/pages/publications/84983208864

M3 - Paper

AN - SCOPUS:84983208864

T2 - DesignCon 2015

Y2 - 27 January 2015 through 30 January 2015

ER -

Package simulations for mitigating noise coupling onto sensitive RF signals

Abstract

Conference

UN SDGs

ASJC Scopus subject areas

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Cite this