Properties of printed films as electrical components and metallization of solar cells

While research is in progress for the development of printed active electronic devices, including printed organic film transistors, power generator devices and memories, our age of information technology is benefitting from integrated circuit (IC) circuits with their integrated active and passive elements in a single chip and from hybrid circuits where active devices are taken from the semiconductor industry to be added to a network of passive electronic components. Thick-film passive components were developed for such hybrid circuits but their application has been spread in other areas and they continue to enter all segments of the electronics industry: military, industrial, data processing, medical, automotive, telecommunications and consumer. This chapter provides an overview of the properties of thick-films applied in this area of electronics, with sections covering resistors, conductors, dielectrics; special emphasis is on the features that make their behavior unique or at least uncommon. Where appropriate, chronological perspective is provided. In addition, the development of thick-film front metallization of silicon solar cells is illustrated.