Original language | English |
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Title of host publication | PIERS 2009 in Moscow Proceedings, August 18-21, 2009 |
Publisher | Electromagnetics Academy |
Pages | 642-646 |
ISBN (Print) | 9781934142103 |
State | Published - 2009 |
Quad Flat Non-lead Package Characterization and Circuit Modeling
M. Sigalov, D. Regev, E. Kabatsky, R. Shavit
Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review