Quad Flat Non-lead Package Characterization and Circuit Modeling

M. Sigalov, D. Regev, E. Kabatsky, R. Shavit

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

Original language	English
Title of host publication	PIERS 2009 MOSCOW VOLS I AND II, PROCEEDINGS
Pages	642-+
State	Published - 2009

Cite this

@inbook{f37a420d1e90477e915553dc1bd4bc94,

title = "Quad Flat Non-lead Package Characterization and Circuit Modeling",

author = "M. Sigalov and D. Regev and E. Kabatsky and R. Shavit",

year = "2009",

language = "???core.languages.en_GB???",

isbn = "978-1-934142-10-3",

pages = "642--+",

booktitle = "PIERS 2009 MOSCOW VOLS I AND II, PROCEEDINGS",

}