| Original language | English GB |
|---|---|
| Title of host publication | PIERS 2009 MOSCOW VOLS I AND II, PROCEEDINGS |
| Pages | 642-+ |
| State | Published - 2009 |
Quad Flat Non-lead Package Characterization and Circuit Modeling
M. Sigalov, D. Regev, E. Kabatsky, R. Shavit
Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review