Quad Flat Non-lead Package Characterization and Circuit Modeling

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

2 Citations (Web of Science)

Original language	English
Title of host publication	PIERS 2009 in Moscow Proceedings, August 18-21, 2009
Publisher	Electromagnetics Academy
Pages	642-646
ISBN (Print)	9781934142103
State	Published - 2009

Cite this

@inbook{f37a420d1e90477e915553dc1bd4bc94,

title = "Quad Flat Non-lead Package Characterization and Circuit Modeling",

author = "M. Sigalov and D. Regev and E. Kabatsky and R. Shavit",

year = "2009",

language = "English",

isbn = "9781934142103",

pages = "642--646",

booktitle = "PIERS 2009 in Moscow Proceedings, August 18-21, 2009",

publisher = "Electromagnetics Academy",

address = "United States",

}