Review of capabilities of the ENEPIG surface finish

Menahem Ratzker; Adam Pearl; Michael Osterman; Michael Pecht; George Milad

doi:10.1007/s11664-014-3322-z

Review of capabilities of the ENEPIG surface finish

Menahem Ratzker, Adam Pearl, Michael Osterman, Michael Pecht, George Milad

Research output: Contribution to journal › Article › peer-review

38 Scopus citations

Abstract

Surface finishes are used to protect exposed copper metallization in printed circuit boards from oxidation and to provide a solderable surface on which to mount electronic components. While it is true that some people have called electroless nickel electroless palladium immersion gold (ENEPIG) a "universal finish" for a wide range of applications from wire bonding to solder interconnects, this paper provides a review of the current literature on ENEPIG and assesses its overall capabilities compared to other surface finishes. Gaps in understanding the performance of ENEPIG as a printed wiring board surface finish are identified and further testing is recommended.

Original language	English
Pages (from-to)	3885-3897
Number of pages	13
Journal	Journal of Electronic Materials
Volume	43
Issue number	11
DOIs	https://doi.org/10.1007/s11664-014-3322-z
State	Published - 1 Nov 2014
Externally published	Yes

Keywords

ENEPIG
reliability
solder interconnects
surface finishes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Materials Chemistry
Electrical and Electronic Engineering

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10.1007/s11664-014-3322-z

Cite this

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title = "Review of capabilities of the ENEPIG surface finish",

abstract = "Surface finishes are used to protect exposed copper metallization in printed circuit boards from oxidation and to provide a solderable surface on which to mount electronic components. While it is true that some people have called electroless nickel electroless palladium immersion gold (ENEPIG) a {"}universal finish{"} for a wide range of applications from wire bonding to solder interconnects, this paper provides a review of the current literature on ENEPIG and assesses its overall capabilities compared to other surface finishes. Gaps in understanding the performance of ENEPIG as a printed wiring board surface finish are identified and further testing is recommended.",

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AU - Pearl, Adam

AU - Osterman, Michael

AU - Pecht, Michael

AU - Milad, George

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N2 - Surface finishes are used to protect exposed copper metallization in printed circuit boards from oxidation and to provide a solderable surface on which to mount electronic components. While it is true that some people have called electroless nickel electroless palladium immersion gold (ENEPIG) a "universal finish" for a wide range of applications from wire bonding to solder interconnects, this paper provides a review of the current literature on ENEPIG and assesses its overall capabilities compared to other surface finishes. Gaps in understanding the performance of ENEPIG as a printed wiring board surface finish are identified and further testing is recommended.

AB - Surface finishes are used to protect exposed copper metallization in printed circuit boards from oxidation and to provide a solderable surface on which to mount electronic components. While it is true that some people have called electroless nickel electroless palladium immersion gold (ENEPIG) a "universal finish" for a wide range of applications from wire bonding to solder interconnects, this paper provides a review of the current literature on ENEPIG and assesses its overall capabilities compared to other surface finishes. Gaps in understanding the performance of ENEPIG as a printed wiring board surface finish are identified and further testing is recommended.

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Review of capabilities of the ENEPIG surface finish

Abstract

Keywords

ASJC Scopus subject areas

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